Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsData collecting ICsData acquisition IC - Touchscreen controller 12 Bit 1x TSC input DSBGA 12

PENIRQ

I C

Serial

Interface

and

Control

SCL

SDA

X+

X-

Y+

Y-

AUX

TEMP

STR

Mux

VDD/REF

Clock

Touch

Screen

Drivers

Interface

FVNF

RESET

GND

SAR

ADC

SureSetControl

SSC

Intercept

Logic

TSC2017

www.ti.com

SBAS472 –DECEMBER 2009

12-Bit, Nanopower, 4-Wire

Micro TOUCH SCREEN CONTROLLER with I

C™ Interface

Check for Samples: TSC2017

FEATURES

APPLICATIONS

• Cellular Phones

234

• 4-Wire Touch Screen Interface

• PDA, GPS, and Media Players

• Single 1.6V to 3.6V Supply/Reference

• Portable Instruments

• Ratiometric Conversion

• Point-of-Sale Terminals

• Effective Throughput Rate:

• Multiscreen Touch Control Systems

– Up to 20kHz (8-Bit) or 10kHz (12-Bit)

• Preprocessing to Reduce Bus Activity

DESCRIPTION

• I

C Interface Supports:

The TSC2017 is a very low-power touch screen

– Standard, Fast, and High-Speed Modes

controller designed to work with power-sensitive,

• Simple, Command-Based User Interface:

handheld applications that are based on an advanced

low-voltage processor. It works with a supply voltage

– TSC2003/TSC2007 Compatible

as low as 1.6V, which can be supplied by a

– 8- or 12-Bit Resolution

single-cell battery. It contains a complete, ultra-low

• On-Chip Temperature Measurement

power, 12-bit, analog-to-digital (A/D) resistive touch

screen converter, including drivers and the control

• Touch Pressure Measurement

logic to measure touch pressure.

• Digital Buffered PENIRQ

In addition to these standard features, the TSC2017

• On-Chip, Programmable PENIRQ Pull-Up

offers preprocessing of the touch screen

• Comprehensive Reset Schemes:

measurements to reduce bus loading, thus reducing

– Power-On, Software, and Hardware Resets

the consumption of host processor resources that can

then be redirected to more critical functions.

• Auto Power-Down Control

• Low Power (12-Bit):

The TSC2017 supports I

C serial bus and data

transmission protocol in all three defined modes:

– 39.31μA at 1.8V, Fast Mode, 8.2kHz Eq Rate

standard, fast, and high-speed. It offers

– 53.32μA at 2.7V, Fast Mode, 8.2kHz Eq Rate

programmable resolution of 8 or 12 bits to

• Enhanced ESD Protection for IEC Testing:

accommodate different screen sizes and performance

needs.

– ±8kV HBM

– ±1kV CDM

The TSC2017 is available in a 12-lead,

(1.555 ±0,055mm) x (2.055 ±0,055mm), 3 x 4 array,

– ±25kV Air Gap Discharge

wafer chip-scale package (WCSP). The TSC2017 is

– ±15kV Contact Discharge

characterized for the –40°C to +85°C industrial

• 2.1 x 1.6 WCSP-12 Package

temperature range.

U.S. Patent NO. 6246394; other patents pending.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SureSet is a trademark of Texas Instruments.

C is a trademark of NXP Semiconductors.

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (38 pages)

PAGE 1
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 12-Bit, Nanopower, 4-Wire Micro TOUCH SCREEN CONTROLLER with I2C™ Interface Check for Samples: TSC2017 FEATURES APPLICATIONS • • • • • • • • • 1 234 • • • • • • • • • • • • 4-Wire Touch Screen Interface Single 1.6V to 3.
PAGE 2
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, VDD = +1.6V to +3.6V, unless otherwise noted. TSC2017 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AUXILIARY ANALOG INPUT Input voltage range 0 VDD Input capacitance V 12 Input leakage current –1 pF +1 μA 12 Bits A/D CONVERTER Resolution Programmable: 8 or 12 bits No missing codes 12-bit resolution 11 Bits ±1.5 LSB (1) VDD = 1.8V –1.2 LSB VDD = 3.0V –3.1 LSB VDD = 1.8V 0.
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TSC2017 SBAS472 – DECEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.6V to +3.6V, unless otherwise noted. TSC2017 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUT/OUTPUT Logic family Logic level CMOS VIH 1.6V ≤ VDD ≤ 3.6V 0.7 × VDD VDD + 0.3 VIL 1.6V ≤ VDD ≤ 3.6V –0.3 0.3 × VDD V IIL SCL and SDA pins –1 1 μA CIN SCL and SDA pins 10 pF VOH IOH = 2 TTL loads VDD – 0.2 VDD V VOL IOL = 2 TTL loads 0 0.
PAGE 5
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 PIN CONFIGURATIONS YZG PACKAGE WCSP-12 (TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE) X+ Y+ X- Y- VDD/REF A0 RESET GND AUX PENIRQ SDA SCL A B C D Rows 3 2 1 Columns (FRONT VIEW) PIN ASSIGNMENTS NO. NAME I/O A/D DESCRIPTION A1 AUX I A A2 VDD/REF A3 X+ I A X+ channel input B1 PENIRQ O D Data available interrupt output. A delayed (process delay) pen touch detect. Pin polarity with active low.
PAGE 6
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com TIMING INFORMATION SDA tSU, STA tSU, DAT tBUF tHD, STA tHD, DAT tLOW SCL tSU, STO tHIGH tHD, STA tR tF START CONDITION REPEATED START CONDITION STOP CONDITION START CONDITION Figure 1. Detailed I/O Timing TIMING REQUIREMENTS All specifications typical at –40°C to +85°C, VDD = 1.6V, unless otherwise noted. 2-WIRE STANDARD MODE PARAMETERS Reset low time TEST CONDITIONS tWL(RESET) 3.6V ≥ VDD ≥ 1.
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TSC2017 www.ti.com SBAS472 – DECEMBER 2009 TIMING REQUIREMENTS: I2C Fast Mode (SCL = 400kHz) All specifications typical at –40°C to +85°C, VDD = 1.6V, unless otherwise noted. TWO-WIRE FAST MODE PARAMETERS TEST CONDITIONS MIN TYP MAX UNIT 400 kHz SCL clock frequency fSCL 0 Bus free time between a STOP and START condition tBUF 1.3 μs Hold time (repeated) START condition tHD, STA 0.6 μs Low period of SCL clock tLOW 1.3 μs High period of the SCL clock tHIGH 0.
PAGE 8
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com TIMING REQUIREMENTS: I2C High-Speed Mode (SCL = 3.4MHz) All specifications typical at –40°C to +85°C, VDD = 1.6V, unless otherwise noted. TWO-WIRE HIGH-SPEED MODE PARAMETERS TEST CONDITIONS MIN TYP UNIT 3.
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TSC2017 www.ti.com SBAS472 – DECEMBER 2009 TYPICAL CHARACTERISTICS At TA = –40°C to +85°C, VDD = +1.6V to +3.6V, PD1 = PD0 = 0, Fast mode, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted. POWER-DOWN SUPPLY CURRENT vs TEMPERATURE SUPPLY CURRENT vs TEMPERATURE 350 High-Speed Mode = 3.4MHz 300 80 VDD = 3.0V VDD = 3.6V Supply Current (mA) Power-Down Supply Current (nA) 100 60 40 VDD = 1.
PAGE 10
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.6V to +3.6V, PD1 = PD0 = 0, Fast mode, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted. CHANGE IN GAIN vs TEMPERATURE CHANGE IN OFFSET vs TEMPERATURE 6 6 VDD = 1.8V VDD = 1.
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TSC2017 www.ti.com SBAS472 – DECEMBER 2009 TYPICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.6V to +3.6V, PD1 = PD0 = 0, Fast mode, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
PAGE 12
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com OVERVIEW The TSC2017 is an analog interface circuit for a human interface touch screen device. All peripheral functions are controlled through the command byte and onboard state machines.
PAGE 13
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 TOUCH SCREEN OPERATION A resistive touch screen operates by applying a voltage across a resistor network and measuring the change in resistance at a given point on the matrix where the screen is touched by an input (stylus, pen, or finger). The change in the resistance ratio marks the location on the touch screen. The TSC2017 supports resistive 4-wire configurations, as shown in Figure 20.
PAGE 14
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com The second method requires knowing both the X-plate and Y-plate resistance, measurement of X-position and Y-position, and Z1. Equation 2 also calculates the touch resistance: RX−plate @ XPosition 4096 Y R TOUCH + *1 *R Y−plate @ 1* Position 4096 4096 Z1 ǒ Ǔ ǒ Ǔ (2) Measure X-Position X+ Y+ Touch X-Position Y- X- Measure Z1-Position Y+ X+ Touch Z1-Position X- Y- Y+ X+ Touch Z2-Position X- YMeasure Z2-Position Figure 21.
PAGE 15
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 INTERNAL TEMPERATURE SENSOR In some applications, such as battery recharging, an ambient temperature measurement is required. The temperature measurement technique used in the TSC2017 relies on the characteristics of a semiconductor junction operating at a fixed current level. The forward diode voltage (VBE) has a well-defined characteristic versus temperature.
PAGE 16
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com ANALOG-TO-DIGITAL CONVERTER Figure 23 shows the analog inputs of the TSC2017. The analog inputs (X, Y, and Z touch panel coordinates, chip temperature and auxiliary inputs) are provided via a multiplexer to the Successive Approximation Register (SAR) A/D converter. The A/D architecture is based on capacitive redistribution architecture, which inherently includes a sample-and-hold function.
PAGE 17
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 Reference The TSC2017 uses an external voltage reference that is applied to the VDD/REF pin. The upper reference voltage range is the same as the supply voltage range, which allows for simple, 1.6V to 3.6V, single-supply operation of the chip. Reference Mode There is a critical item regarding the reference when making measurements while the switch drivers are on. For this discussion, it is useful to consider the basic operation of the TSC2017 (see Figure 19).
PAGE 18
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com Touch Screen Settling In some applications, external capacitors may be required across the touch screen to filter noise picked up by the touch screen (that is, noise generated by the LCD panel or backlight circuitry). These capacitors provide a low-pass filter to reduce the noise, but they also cause a settling time requirement when the panel is touched. The settling time typically shows up as a gain error.
PAGE 19
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 Touch Detect The PENIRQ can be used as an interrupt to the host. RIRQ is an internal pull-up resistor with a programmable value of either 50kΩ (default) or 90kΩ. Write command '1011' (setup command) followed by data '0001' sets the pull-up to 90kΩ. NOTE: The first three bits must be '0's and the select bit is the last bit. To change the pull-up back to 50kΩ, issue write command '1011' followed by data '0000'.
PAGE 20
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com Preprocessing The TSC2017 has a combined MAV filter (median value filter and averaging filter). MAV Filter If the acquired signal source is noisy because of the digital switching circuit, it may necessary to evaluate the data without noise. In this case, the median value filter operation helps remove the noise. The array of seven converted results is sorted first. The middle three values are then averaged to produce the output value of the MAV filter.
PAGE 21
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 I2C INTERFACE The TSC2017 supports the I2C serial bus and data transmission protocol in all three defined modes: standard, fast, and high-speed. A device that sends data onto the bus is defined as a transmitter, and a device receiving data as a receiver. The device that controls the message is called a master. The devices that are controlled by the master are slaves.
PAGE 22
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com Figure 29 details how data transfer is accomplished on the I2C bus. Depending upon the state of the R/W bit, two types of data transfer are possible: 1. Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after the slave address and each received byte. 2. Data transfer from a slave transmitter to a master receiver.
PAGE 23
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 I2C High-Speed Mode (Hs Mode) The TSC2017 can operate with high-speed I2C masters. To do so, the pull-up resistor on SCL must be changed to an active pull-up, as recommended in the I2C specification. Serial data transfer format in High-Speed (Hs) mode meets the Fast or Standard (F/S) mode I2C bus specification. Hs mode can only commence after the following conditions (all of which are in F/S mode) exist: 1. START condition (S) 2. 8-bit master code (00001xxx) 3.
PAGE 24
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com DIGITAL INTERFACE ADDRESS BYTE The TSC2017 has a 7-bit slave address word. The first six bits (MSBs) of the slave address are factory-preset to comply with the I2C standard for A/D converters and are always set at '100100'. The logic state of the address input pin (A0) determines the LSB of the device address to activate communication. Therefore, a maximum of two devices with the same preset code can be connected on the same bus at one time.
PAGE 25
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 When the TSC2017 powers up, the power-down bits must be written to ensure that the device is placed into the mode that achieves the lowest power. Therefore, immediately after power-up, send a command byte that sets PD1 = PD0 = 0, so that the device is in the lowest power mode, powering down between conversions. Table 3.
PAGE 26
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com START A CONVERTER FUNCTION/WRITE CYCLE A conversion/write cycle begins when the master issues the address byte containing the slave address of the TSC2017, with the eighth bit equal to a 0 (R/W = 0), as shown in Table 1. Once the eighth bit has been received, and the address matches the A0 address input pin setting, the TSC2017 issues an acknowledge.
PAGE 27
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 READ A CONVERSION/READ CYCLE For best performance, the I2C bus should remain in an idle state while an A/D conversion is taking place. This idling prevents digital clock noise from affecting the bit decisions being made by the TSC2017. The master should wait for at least 10μs before attempting to read data from the TSC2017 to realize this best performance.
PAGE 28
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com THROUGHPUT RATE AND I2C BUS TRAFFIC Although the internal A/D converter has a sample rate of up to 200kSPS, the throughput presented at the bus is much lower. The rate is reduced because preprocessing manages the redundant work of filtering out noise. The throughput is further limited by the I2C bus bandwidth. The effective throughput is approximately 20kSPS at 8-bit resolution, or 10kSPS at 12-bit resolution.
PAGE 29
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 Table 6. Effective and Equivalent Throughput Rates SUPPLY VOLTAGE I2C BUS SPEED (fSCL) RESOLUTION TSC CONVERSION CYCLE TIME (μs) 100kHz Standard 8-bit 433.6 2.31 16.14 40 127 3780 264.6 12-bit 568.7 1.76 12.31 49 148 1880 531.9 400kHz Fast 8-bit 133.6 7.49 52.40 40 127 3780 264.6 12-bit 201.2 4.97 34.79 49 148 1880 531.9 1.7MHz High-Speed 8-bit 57.1 17.50 122.53 40 127 3780 264.6 12-bit 107.5 9.30 65.
PAGE 30
TSC2017 SBAS472 – DECEMBER 2009 www.ti.
PAGE 31
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 RESET FUNCTION The reset function is controlled by the SureSet™ control logic (SSC). There are three methods to reset the device: hardware reset, software reset, and power-on reset (POR). Hardware Reset Hardware system reset can be performed using the RESET pin. After hardware reset, the device returns to the default configuration and all the settings in the control byte are reset to the default values (see Table 2 and Table 4).
PAGE 32
TSC2017 SBAS472 – DECEMBER 2009 www.ti.com Power-On Reset During TSC2017 power-up, an internal POR is automatically implemented. The POR brings the TSC to the default working condition. The TSC2017 senses the power-up curve and decides whether or not to implement a POR. Follow the power-on/off slope and interval requirements, as provided in the Electrical Characteristics, in order to ensure a proper POR of the TSC2017. tVDD_ON_RAMP tVDD_OFF_RAMP 1.6V to 3.6V 1.4V VDD 0.3V 0V tVDD_OFF Figure 37.
PAGE 33
TSC2017 www.ti.com SBAS472 – DECEMBER 2009 LAYOUT The following layout suggestions should obtain optimum performance from the TSC2017. Keep in mind that many portable applications have conflicting requirements for power, cost, size, and weight. In general, most portable devices have fairly clean power and grounds because most of the internal components are very low power. This situation would mean less bypassing for the converter power and less concern regarding grounding.
PAGE 34
PACKAGE OPTION ADDENDUM www.ti.
PAGE 35
PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TSC2017IYZGR DSBGA YZG 12 3000 180.0 8.4 TSC2017IYZGT DSBGA YZG 12 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.75 2.25 0.81 4.0 8.0 Q1 1.75 2.25 0.81 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSC2017IYZGR DSBGA YZG 12 3000 182.0 182.0 17.0 TSC2017IYZGT DSBGA YZG 12 250 182.0 182.0 17.
PAGE 37
D: Max = 2.1 mm, Min = 2.04 mm E: Max = 1.6 mm, Min = 1.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.