Datasheet

PIN CONFIGURATION
1 2 3 4
NC
NC
PENIRQ
SDO
X-
Y+
X+
VDD/REF
13
14
15
16
8
7
6
5
TSC2008
ThermalPad
AUX GND Y-
NC
SDI
CS
SCLK
12 11 10 9
NC
C lumnso
(FRONTVIEW)
A CB D
Y-
GND AUXSCLK
X-X+VDD/REF
3
2
1
PENIRQSDO
CS
Rows
Y+
SDI
TSC2008
www.ti.com .......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009
RGV PACKAGE
(1)
YZG PACKAGE
4 x 4 QFN-16
WCSP-12
(TOP VIEW)
(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)
(1) The thermal pad is internally connected to
the substrate. The thermal pad can be
connected to the analog ground or left
floating. Keep the thermal pad separate
from the digital ground, if possible.
PIN ASSIGNMENTS
PIN NO.
PIN
QFN WCSP NAME I/O A/D DESCRIPTION
1 — NC No connection
2 B1 SDI I D Serial data input
3 A1 CS I D Chip select
4 A2 SCLK I D Serial clock input
5 A3 VDD/REF Supply voltage and external reference input
6 B3 X+ I A X+ channel input
7 C3 Y+ I A Y+ channel input
8 D3 X – I A X – channel input
9 D2 Y – I A Y – channel input
10 B2 GND Ground
11 — NC No connection
12 C2 AUX I A Auxiliary channel input. If not used, this input should be grounded.
13 — NC No connection
14 — NC No connection
Pen touch interrupt output. Active low when pen is touched. The output remains low until conversion is
15 D1 PENIRQ O D
complete or pen touch is released. The rising edge signals the end of conversion (EOC).
16 C1 SDO O D Serial data output
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Product Folder Link(s): TSC2008