Datasheet

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TSC2008

FEATURES APPLICATIONS

DESCRIPTION

PENIRQ

SPI

Serial

Interface

and

Control

SDI

X+

X-

Y+

Y-

AUX

TEMP

Mux

VDD/REF

GND

SAR

ADC

Internal

Clock

Touch

Screen

Sensor

Drivers

Preprocessing

SCLK

SDO

TSC2008

www.ti.com

.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009

1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire

Micro TOUCH SCREEN CONTROLLER with SPI™

• Cellular Phones

234

• 4-Wire Touch Screen Interface

• PDA, GPS, and Media Players

• Single 1.2V to 3.6V Supply/Reference

• Portable Instruments

• Ratiometric Conversion

• Point-of-Sale Terminals

• Effective Throughput Rate:

• Multi-Screen Touch Control Systems

– Up to 20kHz (8-Bit) or 10kHz (12-Bit)

• Preprocessing to Reduce Bus Activity

• High-Speed SPI (up to 25MHz)

The TSC2008 is a very low-power touch screen

• Simple Command-Based User Interface:

controller designed to work with power-sensitive,

– TSC2046 Compatible

handheld applications that are based on advanced

low-voltage processors. It works with a supply voltage

– 8- or 12-Bit Resolution

as low as 1.2V, which can be supplied by a

• On-Chip Temperature Measurement

single-cell battery. It contains a complete, ultra-low

• Touch Pressure Measurement

power, 12-bit, analog-to-digital (A/D) resistive touch

screen converter, including drivers and the control

• Digital Buffered PENIRQ

logic to measure touch pressure.

• On-Chip, Programmable PENIRQ Pull-up

In addition to these standard features, the TSC2008

• Auto Power-Down Control

offers preprocessing of the touch screen

• Low Power (12-Bit, 8.2kHz Eq Rate):

measurements to reduce bus loading, thus reducing

– 30.4 µ A at 1.2V, f

SCLK

= 5MHz

the consumption of host processor resources that can

then be redirected to more critical functions.

– 35.5 µ A at 1.8V, f

SCLK

= 10MHz

– 44.6 µ A at 2.7V, f

SCLK

= 10MHz

The TSC2008 supports an SPI serial bus and data

transmission. It offers programmable resolution of 8

• Power-On, Software, and SureSet™ Resets

or 12 bits to accommodate different screen sizes and

• Enhanced ESD Protection:

performance needs.

– ± 8kV HBM

The TSC2008 is available in a 12-lead,

– ± 1kV CDM

(1,555 ± 0,055mm) x (2,055 ± 0,055mm) 3 x 4 array,

– ± 25kV Air Gap Discharge

wafer chip-scale package (WCSP), and a 16-pin,

4 x 4 QFN package. The TSC2008 is characterized

– ± 15kV Contact Discharge

for the – 40 ° C to +85 ° C industrial temperature range.

• 1.5 x 2 WCSP-12 and 4 x 4 QFN-16 Packages

U.S. Patent No. 6246394; other patents pending.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 SureSet is a trademark of Texas Instruments.

3 SPI is a trademark of Motorola Inc.

4 All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (41 pages)

PAGE 1
TSC2008 TS C20 08 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire Micro TOUCH SCREEN CONTROLLER with SPI™ FEATURES APPLICATIONS • • • • • • • • • 1 234 • • • • • • • • • • • • 4-Wire Touch Screen Interface Single 1.2V to 3.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
PAGE 3
TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted. TSC2008 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUT/OUTPUT Logic family CMOS VIH VIL Logic level 1.2V ≤ VDD < 3.6V 0.7 × VDD VDD + 0.3 V 1.2V ≤ VDD < 1.6V –0.
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TSC2008 www.ti.com..........................................................................................................................................................
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com TIMING INFORMATION The TSC2008 supports SPI programming in mode CPOL = 0 and CPHA = 0. The falling edge of SCLK is used to change the output (MISO) data, and the rising edge is used to latch the input (MOSI) data.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 TIMING REQUIREMENTS (1) All specifications typical at –40°C to +85°C, VDD = 1.6V, unless otherwise noted. PARAMETER tC(SCLK) SPI serial clock cycle time TEST CONDITIONS SPI serial clock frequency MAX UNIT 182 ns 1.6 ≤ VDD < 2.7V, 40% to 60% duty cycle 62.5 ns 2.7V ≤ VDD ≤ 3.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 TYPICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode, non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 OVERVIEW The TSC2008 is an analog interface circuit for a human interface touch screen device. All peripheral functions are controlled through the command byte and onboard state machines.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com TOUCH SCREEN OPERATION A resistive touch screen operates by applying a voltage across a resistor network and measuring the change in resistance at a given point on the matrix where the screen is touched by an input (stylus, pen, or finger).
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 The second method requires knowing both the X-plate and Y-plate resistance, measurement of X-Position and Y-Position, and Z1.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com INTERNAL TEMPERATURE SENSOR In some applications, such as battery recharging, an ambient temperature measurement is required. The temperature measurement technique used in the TSC2008 relies on the characteristics of a semiconductor junction operating at a fixed current level.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 ANALOG-TO-DIGITAL CONVERTER Figure 24 shows the analog inputs of the TSC2008. The analog inputs (X, Y, and Z touch panel coordinates, chip temperature and auxiliary inputs) are provided via a multiplexer to the Successive Approximation Register (SAR) analog-to-digital converter (ADC).
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com Reference Mode There is a critical item regarding the reference when making measurements while the switch drivers are on. For this discussion, it is useful to consider the basic operation of the TSC2008 (see Figure 20).
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 Touch Screen Settling In some applications, external capacitors may be required across the touch screen to filter noise picked up by the touch screen (that is, noise generated by the LCD panel or backlight circuitry).
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com Connect to Analog Supply VDD/REF PENIRQ VDD RIRQ Pen Touch Control Logic TEMP1 High when the X+ or Y+ driver is on. X+ TEMP2 Y+ Sense GND Y- High when the X+ or Y+ driver is on, or when any sensor connection/shortcircuit tests are activated. ON Vias go to system analog ground plane.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 DIGITAL INTERFACE The TSC2008 communicates through a standard SPI bus. The SPI allows full-duplex, synchronous, serial communication between a host processor (the master) and peripheral devices (slaves). The SPI master generates the synchronizing clock and initiates transmissions.
PAGE 20
TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com CONTROL BYTE The control byte (on SDI), as shown in Table 2, provides the start conversion, addressing, A/D converter resolution, configuration, and power-down of the TSC2008.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 The control byte begins with a start bit followed by seven control bits. For the command to be valid, the start bit must be '1'. Do not use '0' for the start bit; it is reserved for factory use.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com PD0 and PD1—The power-down bits select the power-down mode that the TSC2008 will be in after the current command completes, as shown in Table 5. It is recommended to set PD0 = '0' in each command byte to get the lowest power consumption possible.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 Data Format The TSC2008 output data are in Straight Binary format as shown in Figure 29. This figure shows the ideal output code for the given input voltage and does not include the effects of offset, gain, or noise. FS = Full-Scale Voltage = VREF(1) 1LSB = VREF(1)/4096 1LSB 11...
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com 12-BIT OPERATION TIMING A single touch result can be easily achieved using 24 SCLKs per cycle operation when the 12-bit ADC mode is used, as shown in Figure 30.
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TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 8-BIT OPERATION TIMING If the 8-bit ADC mode produces an acceptable result, then 16 SCLKs per cycle operation can also be used, as shown in Figure 32.
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TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com POWER DISSIPATION There are two major power modes for the TSC2008: full-power (PD0 = '1') and auto power-down (PD0 = '0').
PAGE 27
TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 12-Bit Operation For 12-bit operation, sending the conversion result across the SPI bus takes 16 or 24 bus clocks (SCLK clock); see Figure 31 and Figure 30.
PAGE 28
TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com As an example, use VDD = 1.2V and 12-bit mode with 2MHz SPI clock (fSCLK = 2MHz). The equivalent TSC throughput is at least seven times faster than the effective throughput across the bus (9.26k x 7 = 64.82kSPS). The supply current to the TSC for this rate and configuration is 240.08µA.
PAGE 29
TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 RESET The TSC2008 can be reset with three different methods: power-on reset (POR), software reset, and the proprietary SureSet function.
PAGE 30
TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com Power-On Reset During TSC2008 power up, an internal power-on reset (POR) is triggered if the power-supply ramping meets the timing requirements shown in Figure 37 and listed in Table 9. The recommended and typical VDD off times are shown in Figure 38.
PAGE 31
TSC2008 www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009 LAYOUT The following layout suggestions should obtain optimum performance from the TSC2008. Keep in mind that many portable applications have conflicting requirements for power, cost, size, and weight.
PAGE 32
TSC2008 SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (December 2008) to Revision B ...........................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TSC2008IRGVR Package Package Pins Type Drawing VQFN RGV 16 TSC2008IRGVT VQFN RGV TSC2008IYZGR DSBGA YZG TSC2008IYZGT DSBGA YZG SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 16 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 12 3000 180.0 8.4 1.75 2.25 0.81 4.
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PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSC2008IRGVR VQFN RGV 16 2500 367.0 367.0 35.0 TSC2008IRGVT VQFN RGV 16 250 210.0 185.0 35.0 TSC2008IYZGR DSBGA YZG 12 3000 182.0 182.0 17.0 TSC2008IYZGT DSBGA YZG 12 250 182.0 182.0 17.
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D: Max = 2.1 mm, Min = 2.04 mm E: Max = 1.6 mm, Min = 1.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.