Datasheet

PIN CONFIGURATION
X
Y
SNSGND
NC
-
-
CS
TSC2006
16
17
18
19
20
10
9
8
7
6
ThermalPad
1 2 3 4 5
15 14 13 12 11
AGND
AUX
NC
I/OVDD
DGND
SUBGND
Y+ X+
SNSVDD
VREF
SDO
SCLK
SDI
PINTDAV
RESET
TSC2006
www.ti.com ......................................................................................................................................................... SBAS415C – JUNE 2007 – REVISED MARCH 2009
RTJ PACKAGE
(1)
QFN-20
(TOP VIEW)
(1) The thermal pad is internally connected to SUBGND. The thermal pad can be connected to the analog ground or left
floating. Keep the thermal pad separate from the digital ground, if possible.
PIN ASSIGNMENTS
PIN PIN
NO. NAME I/O A/D DESCRIPTION
1 SDO I/O D Serial data output. This output is the MISO signal for the SPI protocol.
2 SCLK I D Serial clock input
3 SDI I D Serial data input. This input is the MOSI signal for the SPI protocol.
4 PINTDAV O D Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.
5 RESET I D System reset. All register values reset to default values.
6 DGND Digital ground
7 I/OVDD Digital I/O interface voltage
8, 19 NC No connection
9 AUX I A Auxiliary channel input
10 AGND Analog ground
11 VREF I A External reference input
12 SNSVDD Power supply for sensor drivers and other analog blocks
13 X+ I A X+ channel input
14 Y+ I A Y+ channel input
15 SUBGND Substrate ground (for ESD current)
16 X – I A X – channel input
17 Y – I A Y – channel input
18 SNSGND Sensor driver return
20 CS I D Chip select. This input is the slave select ( SS) signal for the SPI protocol.
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