Datasheet
www.ti.com
PIN CONFIGURATIONS
X
Y
SNSGND
NC
AD0
-
-
TSC2004
16
17
18
19
20
10
9
8
7
6
ThermalPad
1 2 3 4 5
15 14 13 12 11
AGND
AUX
NC
I/OVDD
DGND
SUBGND
Y+
X+
SNSVDD
VREF
SDA
SCL
AD1
PINTDAV
RESET
Columns
(FRONT VIEW)
A
C
EB D
NCAD1 SNSGNDNCDGND
4
NCNC Y-
I/OVDD
3
SUBGNDNC
X-
AUX
2
X+VREF Y+
SNSVDD
AGND
1
SDA
PINTDAV
AD0
SCL
RESET
5
Rows
NC
TSC2004
SBAS408E – JUNE 2007 – REVISED MARCH 2008
RTJ PACKAGE
(1)
YZK PACKAGE
QFN-20
WCSP-18
(TOP VIEW)
(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)
(1) The thermal pad is internally connected to
SUBGND. The thermal pad can be
connected to the analog ground or left
floating. Keep the thermal pad separate
from the digital ground, if possible.
PIN ASSIGNMENTS
PIN NO.
PIN
QFN WCSP NAME I/O A/D DESCRIPTION
1 D1 SDA I/O D Serial data I/O
2 C1 SCL I D Serial clock.
3 B2 AD1 I D Address input bit 1
4 A1 PINTDAV O D Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.
5 B1 RESET I D System reset. All register values reset to default values.
6 A2 DGND Digital ground
7 A3 I/OVDD Digital I/O interface voltage
B3, B4,
No internal connection, but solder bumps are populated. These pins may be connected to analog ground
8, 19 C2, C3, NC
for mechanical stability.
D2, D3
9 A4 AUX I A Auxiliary channel input
10 A5 AGND Analog ground
11 B5 VREF I A External reference input
12 C5 SNSVDD Power supply for sensor drivers and other analog blocks.
13 D5 X+ I A X+ channel input
14 E5 Y+ I A Y+ channel input
15 D4 SUBGND Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended.
16 E4 X – I A X – channel input
17 E3 Y – I A Y – channel input
18 E2 SNSGND Sensor driver return
20 E1 AD0 I D Address input bit 0
— C4 NC No solder bump for this location.
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