Datasheet
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
TSC2004
SBAS408E – JUNE 2007 – REVISED MARCH 2008
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
TYPICAL TYPICAL NO MISSING
INTEGRAL GAIN CODES SPECIFIED TRANSPORT
LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY
Small Tape
TSC2004IRTJT
20-Pin,
and Reel, 250
0.8 x 4 x 4 RTJ – 40 ° C to +85 ° C TSC2004I
Tape and
Thin QFN
TSC2004IRTJR
Reel, 3000
TSC2004 – 0.8 to +1.4 +0.1 11
18-Pin, Small Ta\pe
TSC2004IYZKT
5 x 5 Matrix, and Reel, 250
2.5 x 2.5 YZK – 40 ° C to +85 ° C TSC2004I
Tape and
DSBGA
TSC2004IYZKR
Reel, 3000
(WCSP)
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted).
TSC2004 UNIT
Analog input X+, Y+, AUX to SNSGND – 0.4 to SNSVDD + 0.1 V
Analog input X – , Y – to SNSGND – 0.4 to SNSVDD + 0.1 V
SNSVDD to SNSGND – 0.3 to 5 V
Voltage range
SNSVDD to AGND – 0.3 to 5 V
I/OVDD to DGND – 0.3 to 5 V
SNSVDD to I/OVDD – 2.40 to +0.3 V
Digital input voltage to DGND – 0.3 to I/OVDD + 0.3 V
Digital output voltage to DGND – 0.3 to I/OVDD + 0.3 V
Power dissipation (T
J
Max - T
A
)/ θ
JA
Low-K 113 ° C/W
WCSP package
Thermal impedance, θ
JA
High-K 62 ° C/W
QFN package 39.97 ° C/W
Operating free-air temperature range, T
A
– 40 to +85 ° C
Storage temperature range, T
STG
– 65 to +150 ° C
Junction temperature, T
J
Max +150 ° C
Vapor phase (60 sec) +215 ° C
Lead temperature
Infrared (15 sec) +220 ° C
IEC contact discharge
(2)
X+, X – , Y+, Y – ± 12 kV
IEC air discharge
(2)
X+, X – , Y+, Y – ± 25 kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
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