Datasheet
TSC2003
2
SBAS162G
www.ti.com
MAXIMUM MAXIMUM SPECIFIED
RELATIVE ACCURACY GAIN ERROR PACKAGE TEMPERATURE PACKAGE ORDERING
PRODUCT (LSB) (LSB) PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER
TSC2003 ±2 ±4 TSSOP-16 PW –40°C to +85°C TSC2003I TSC2003IPW
TSC2003 ±2 ±4 TSSOP-16 PW –40°C to +85°C TSC2003I TSC2003IPWT
TSC2003 ±2 ±4 TSSOP-16 PW –40°C to +85°C TSC2003I TSC2003IPWR
TSC2003 ±2 ±4 TSSOP-16 PW –40°C to +85°C TSC2003I TSC2003IPWRG4
TSC2003 ±2 ±4 VFBGA-48 ZQC –40°C to +85°C BC2003 TSC2003IZQCT
TSC2003 ±2 ±4 VFBGA-48 ZQC –40°C to +85°C BC2003 TSC2003IZQCR
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or refer to our web
site at www.ti.com.
PIN CONFIGURATION
Top View VFBGA
PIN DESCRIPTIONS
TSSOP VFBGA
PIN # PIN # NAME DESCRIPTION
1 C1, D1 +V
DD
Power Supply
2 E1 X+ X+ Position Input
3 F1 Y+ Y+ Position Input
4G1X– X– Position Input
5G2Y– Y– Position Input
6 G3, G4 GND Ground
7G5V
BAT1
Battery Monitor Input
8G6V
BAT2
Battery Monitor Input
9B7V
REF
Voltage Reference Input/Output
10 A7 PENIRQ Pen Interrupt. Open Drain Output (Requires
30kΩ to 100kΩ pull-up resistor externally).
11 A6 SDA Serial Data
12 A4 SCL Serial Clock
13 A3 A1 I
2
C Bus Address Input A1
14 A2 A0 I
2
C Bus Address Input A0
15 A1 IN2 Auxiliary A/D Converter Input
16 B1 IN1 Auxiliary A/D Converter Input
ABSOLUTE MAXIMUM RATINGS
(1)
+V
DD
to GND ........................................................................ –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +V
DD
+ 0.3V
Analog Input Voltage to GND. All Pins Except 7, 8 ......
–0.3V to +V
DD
+ 0.3V
Analog Input Voltage Pins 7, 8 to GND ........................... –0.3V to +6.0V
Operating Temperature Range ........................................–40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Power Dissipation .......................................................... (T
J
Max – T
A
)/
θ
JA
TSSOP Package
Junction Temperature (T
J
Max) .............................................. +150°C
θ
JA
Thermal Impedance ................................................... +115.2°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ............................................................ +215°C
Infrared (15s) ..................................................................... +220°C
VFBGA Package
Junction Temperature (T
J
Max) .............................................. +125°C
θ
JA
Thermal Impedance ........................................................ +50°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ............................................................ +215°C
Infrared (15s) ..................................................................... +220°C
NOTE: (1) Stresses above those listed under
Absolute Maximum Ratings
may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
(1)
1
2
3
4
5
6
7
8
+V
DD
X+
Y+
X–
Y–
GND
V
BAT1
V
BAT2
IN1
IN2
A0
A1
SCL
SDA
PENIRQ
V
REF
16
15
14
13
12
11
10
9
TSC2003
Top View TSSOP
NC = No Connection
NC
NCA
21
3 456 7
A0
IN1
IN2
+V
DD
+V
DD
X+
Y+
PENIRQ
V
REF
A1 SCL SDA
X− Y− GND GND V
BAT1
NC
NC
NC
NC
NC
B
C
D
E
F
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC NC
NC
NC
NC
NC
NC
NC
NC
NC
G
V
BAT2