Datasheet

TSB81BA3D, TSB81BA3DI
IEEE 1394b THREE-PORT CABLE TRANSCEIVER/ARBITER
SLLS559E − DECEMBER 2002 − REVISED JUNE 2006
55
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL PAD MECHANICAL DATA
This PowerPAD™ package incorporates an exposed thermal pad that is designed to be attached directly to an
external heatsink. When the thermal pad is soldered directly to the printed circuit board (PCB), the PCB can
be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly
to a ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer
from the integrated circuit (IC).
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities,
refer to the Technical Brief, PowerPAD Thermally Enhanced Package, TI literature number SLMA002 and the
Application Brief, PowerPAD Made Easy, TI literature number SLMA004. Both documents are available at
www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.