Datasheet


   

SLLS423I − JUNE 2000 − REVISED MARCH 2005
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
thermal characteristics, PAP package
PARAMETER TEST CONDITIONS
†
MIN TYP MAX UNIT
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, high conductivit
y
TI-recommended test board, chip soldered or
26 °C/W
R
θJC
Junction-to-case-thermal resistance
TI-recommended test board, chip soldered or
greased to thermal land with 1 oz. copper
5.9 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, high conductivit
y
TI-recommended test board with thermal land, but
58.6 °C/W
R
θJC
Junction-to-case thermal resistance
TI-recommended test board with thermal land, but
no solder or grease thermal connection to therma
l
land with 1 oz. copper
5.9 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, low conductivity
60.1 °C/W
R
θJC
Junction-to-case thermal resistance
Board-mounted, no air flow, low conductivity
JEDEC test board with 1 oz. copper
5.9 °C/W
†
Use of thermally enhanced PowerPad PAP package is assumed in all three test conditions.
thermal characteristics, PHP package
PARAMETER TEST CONDITIONS
†
MIN TYP MAX UNIT
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, high conductivit
y
TI-recommended test board, chip soldered or
31.9 °C/W
R
θJC
Junction-to-case-thermal resistance
TI-recommended test board, chip soldered or
greased to thermal land with 1 oz. copper
6.2 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, high conductivit
y
TI-recommended test board with thermal land, but
65.8 °C/W
R
θJC
Junction-to-case thermal resistance
TI-recommended test board with thermal land, but
no solder or grease thermal connection to therma
l
land with 1 oz. copper
6.2 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, low conductivity
85.7 °C/W
R
θJC
Junction-to-case thermal resistance
Board-mounted, no air flow, low conductivity
JEDEC test board with 1 oz. copper
6.2 °C/W
†
Use of thermally enhanced PowerPad PHP package is assumed in all three test conditions.
thermal characteristics, GQE package
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, JEDEC low-k test
118.12 °C/W
R
θJC
Junction-to-case-thermal resistance
Board-mounted, no air flow, JEDEC low-k test
board, no thermal vias used on board
38.62 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, JEDEC high-k test
56.61 °C/W
R
θJC
Junction-to-case-thermal resistance
Board-mounted, no air flow, JEDEC high-k test
board, no thermal vias used on board
38.62 °C/W
thermal characteristics, ZQE package
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, JEDEC low-k test
119.63 °C/W
R
θJC
Junction-to-case-thermal resistance
Board-mounted, no air flow, JEDEC low-k test
board, no thermal vias used on board
39.03 °C/W
R
θJA
Junction-to-ambient thermal resistance
Board-mounted, no air flow, JEDEC high-k test
58.32 °C/W
R
θJC
Junction-to-case-thermal resistance
Board-mounted, no air flow, JEDEC high-k test
board, no thermal vias used on board
39.09 °C/W