Datasheet


   

SLLS423I − JUNE 2000 − REVISED MARCH 2005
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
†
Supply voltage range, V
DD
(see Note 1) −0.3 V to 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
−0.5 V to V
DD
+ 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range at any output, V
O
−0.5 V to V
DD
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free air temperature, T
A
0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
T
A
≤ 25°C
POWER RATING
DERATING FACTOR
‡
ABOVE T
A
= 25°C
T
A
= 70°C
POWER RATING
PAP
§
4.78 W 38 mW/°C 3.06 W
PAP
¶
2.13 W 17 mW/°C 1.36 W
PAP
#
2.08 W 16 mW/°C 1.33 W
PHP
§
3.92 W 31.4 mW/°C 2.51 W
PHP
¶
1.9 W 10.4 mW/°C 1.22 W
PHP
#
1.45 W 11 mW/°C 0.93 W
GQE
||
1.76 W 17.6 mW/°C 0.97 W
GQE
#
0.84 W 8.4 mW/°C 0.46 W
ZQE
||
1.71 W 17.1 mW/°C 0.94 W
ZQE
#
0.83 W 8.4 mW/°C 0.45 W
‡
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θJA
).
§
1 oz. trace and copper pad with solder
¶
1 oz. trace and copper pad without solder
#
Standard JEDEC low-K board
||
Standard JEDEC high-K board
For more information, refer to TI technical brief PowerPAD Thermally Enhanced Package, TI literature number
SLMA002.
PowerPAD is a trademark of Texas Instruments.