Datasheet

5–1
5 Electrical Characteristics
5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
(Unless Otherwise Noted)
†
Supply voltage range, V
CC
–0.5 V to 3.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage range, V
CC
5V –0.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(standard TTL/LVCMOS) –0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(5-V standard TTL/LVCMOS) –0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . . . .
Output voltage range, (standard TTL/LVCMOS) V
O
–0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . . . . .
Output voltage range, (5-V standard TTL/LVCMOS) V
O
–0.5 V to V
CC
+ 0.5 V. . . . . . . . . . . . . . .
Input clamp current, I
IK
(TTL/LVCMOS) (V
I
< 0 or V
I
> V
CC
) (see Note 1) ±20 mA. . . . . . . . . . . .
Output clamp current, I
OK
(TTL/LVCMOS) (V
O
< 0 or V
O
> V
CC
) (see Note 2) ±20 mA. . . . . . . .
Continuous total power dissipation See Maximum Dissipation Rating Table. . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
–40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
–65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
NOTES: 1. This applies to external input and bidirectional buffers. For 5-V tolerant terminals, use V
I
> V
CC
5V.
2. This applies to external output and bidirectional buffers. For 5-V tolerant terminals, use V
O
> V
CC
5V.
MAXIMUM DISSIPATION RATING TABLE
PACKAGE
T
A
≤ 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
PACKAGE
A
POWER RATING ABOVE T
A
= 25°C
A
POWER RATING
A
POWER RATING
PZT 1500 mW 16.9 mW/°C 739.5 mW 486 mW
PACKAGE THERMAL RESISTANCE (R
θ
) CHARACTERISTICS
†
PARAMETER
TEST CONDITIONS
PZT PACKAGE
UNIT
PARAMETER
TEST
CONDITIONS
MIN NOM MAX
UNIT
R
θJA
Junction-to-ambient thermal resistance
Board mounted,
No air flow
59 °C/W
R
θJC
Junction-to-case thermal resistance 13 °C/W
T
J
Junction temperature 115 °C
†
Thermal resistance characteristics very depending on die and leadframe pad size as well as mold compound. These
values represent typical die and pad sizes for the respective packages. The R value decreases as the die or pad sizes
increases. Thermal values represent PWB bands with minimal amounts of metal.