Datasheet

TS5A63157
SCDS203A – DECEMBER 2005 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
ORDERING INFORMATION
(1)
ORDERABLE TOP-SIDE
T
A
PACKAGE
(2)
PART NUMBER MARKING
(3)
NanoStar™ – WCSP (DSBGA)
Tape and reel TS5A63157YEPR
(4)
0.23-mm Large Bump – YEP
PREVIEW
NanoFree™ – WCSP (DSBGA)
Tape and reel TS5A63157YZPR
(4)
– 40 ° C to 85 ° C
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV Tape and reel TS5A63157DBVR JBE_
SOT (SC-70) – DCK Tape and reel TS5A63157DCKR J7_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com .
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer faab/assembly site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
(4) Package preview
PIN DESCRIPTION
NO. NAME DESCRIPTION
1 NO Normally open
2 GND Digital ground
3 NC Normally closed
4 COM Common
5 V
+
Power supply
6 IN Digital control to connect COM to NO or NC
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Product Folder Link(s): TS5A63157