Datasheet

TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010 www.ti.com
SUMMARY OF CHARACTERISTICS
(1)
2:1 Multiplexer/
Configuration Demultiplexer
(1 × SPDT)
Number of channels 1
On-state resistance (r
on
) 1.1 Ω
On-state resistance match (Δr
on
) 0.1 Ω
On-state resistance flatness (r
on(flat)
) 0.15 Ω
Turn-on/turn-off time (t
ON
/t
OFF
) 20 ns/15 ns
Break-before-make time (t
BBM
) 12 ns
Charge injection (Q
C
) –20 pC
Bandwidth (BW) 100 MHz
OFF isolation (O
ISO
) –65 dB at 1 MHz
Crosstalk (X
TALK
) –66 dB at 1 MHz
Total harmonic distortion (THD) 0.01%
Leakage current (I
NO(OFF)
/I
NC(OFF)
) ±20 nA
Power-supply current (I
+
) 50 nA
Package options 6-pin DBV, DCK, or YZP
(1) V
+
= 5 V, T
A
= 25°C
ORDERING INFORMATION
(1)
ORDERABLE TOP-SIDE
T
A
PACKAGE
(2)
PART NUMBER MARKING
(3)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 TS5A3159AYZPR _ _ _JJ_
0.23-mm Large Bump – YZP (Pb-free)
–40°C to 85°C
SOT (SOT-23) – DBV Reel of 3000 TS5A3159ADBVR JAJ_
SOT (SC-70) – DCK
(3)
Reel of 3000 TS5A3159ADCKR JJ_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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