Datasheet
SSOP OR VSSOP PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC1
COM1
IN2
GND
COM2
IN1
V
+
NC2
YZP PACKAGE
(BOTTOM VIEW)
GND
IN1
COM2
V
+
2
3
4
8
7
5
6
IN2
COM1
NC1
NC2
1
TS5A23167
www.ti.com
SCDS195A –MAY 2005–REVISED SEPTEMBER 2012
0.9-Ω DUAL SPST ANALOG SWITCH
5-V/3.3-V 2-CHANNEL ANALOG SWITCH
Check for Samples: TS5A23167
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FEATURES
APPLICATIONS
• Isolation in Powered-Off Mode, V
+
= 0 • Cell Phones
• Low ON-State Resistance (0.9 Ω) • PDAs
• Control Inputs Are 5.5-V Tolerant • Portable Instrumentation
• Low Charge Injection • Audio and Video Signal Routing
• Low Total Harmonic Distortion (THD) • Low-Voltage Data Acquisition Systems
• 1.65-V to 5.5-V Single-Supply Operation • Communication Circuits
• Latch-Up Performance Exceeds 100 mA Per • Modems
JESD 78, Class II
• Hard Drives
• ESD Performance Tested Per JESD 22
• Computer Peripherals
– 2000-V Human-Body Model(A114-B, Class
• Wireless Terminals and Peripherals
II)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V
to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD)
performance and consumes very low power. These features make this device suitable for portable audio
applications.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP Tape and reel TS5A23167YZPR J87
(Pb-free)
–40°C to 85°C
SSOP – DCT Tape and reel TS5A23167DCTR JAP_
VSSOP – DCU (Pb-free) Tape and reel TS5A23167DCUR JAP_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The acutal top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.