Datasheet

V+
GND
NC
NO
COM
IN
TS5A12301E
SCES707B –AUGUST 2008– REVISED APRIL 2011 www.ti.com
Table 2. ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
WCSP (DSBGA)
–40°C to 85°C Tape and reel TS5A12301EYFPR _ _ _ 3W_
0.4-mm Pitch – YFP (Pb-free)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
SUMMARY OF CHARACTERISTICS
(1)
2:1 Multiplexer/Demultiplexer
Configuration
(1 × SPDT)
Number of channels 1
ON-state resistance (r
on
) 0.75 Ω max
ON-state resistance match (Δr
on
) 0.1 Ω max
ON-state resistance flatness (r
on(flat)
) 0.1 Ω max
Turn-on/turn-off time (t
ON
/t
OFF
) 110 ns/100 ns
Break-before-make time (t
BBM
) 10 ns
Charge injection (Q
C
) 97 pC
Bandwidth (BW) 55 MHz
OFF isolation (O
ISO
) –63 dB at 1 MHz
Crosstalk (X
TALK
) –63 dB at 1 MHz
Total harmonic distortion (THD) 0.003%
Leakage current (I
NO(OFF)
/I
NC(OFF)
) 20 nA
Package option 6-pin WCSP, 0.4-mm pitch
(1) V
+
= 5 V, T
A
= 25°C
FUNCTION TABLE
NC TO COM, NO TO COM,
IN
COM TO NC COM TO NO
L or Open ON OFF
H OFF ON
Figure 1. Logic Diagram
2 Copyright © 2008–2011, Texas Instruments Incorporated