Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TS3V330D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TS3V330DBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TS3V330DBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TS3V330DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS3V330PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM