Datasheet

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FEATURES

D, DBQ, DGV, OR PW PACKAGE

(TOP VIEW)

RGY PACKAGE

(TOP VIEW)

1 16

8 9

GND

DESCRIPTION/ORDERING INFORMATION

TS3V330

QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH

WITH LOW ON-STATE RESISTANCE

SCDS162C – MAY 2004 – REVISED JULY 2005

• Low Differential Gain and Phase (D

= 0.82%,

= 0.1 Degree Typ)

• Wide Bandwidth (BW = 300 MHz Min)

• Low Crosstalk (X

TALK

= –80 dB Typ)

• Low Power Consumption

= 10 µ A Max)

• Bidirectional Data Flow With Near-Zero

Propagation Delay

• Low ON-State Resistance (r

= 3 Ω Typ)

• Rail-to-Rail Switching on Data I/O Ports

(0 to V

)

• V

Operating Range From 3 V to 3.6 V

• I

off

Supports Partial-Power-Down Mode

Operation

• Data and Control Inputs Provide Undershoot

Clamp Diode

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Suitable for Both RGB and Composite-Video

Switching

The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable ( EN) input.

When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is

disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data

path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device

has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

ORDERING INFORMATION

PACKAGE

(1)

ORDERABLE PART NUMBER TOP-SIDE MARKING

QFN – RGY Tape and reel TS3V330RGYR TF330

Tube TS3V330D

SOIC – D TS3V330

Tape and reel TS3V330DR

–40 ° C to 85 ° C SSOP (QSOP) – DBQ Tape and reel TS3V330DBQR TF330

Tube TS3V330PW

TSSOP – PW TF330

Tape and reel TS3V330PWR

TVSOP – DGV Tape and reel TS3V330DGVR TF330

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 FEATURES • • • • • • 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC EN S1D S2D DD S1C S2C DC RGY PACKAGE (TOP VIEW) S1A S2A DA S1B S2B DB VCC • • 1 1 16 15 EN 14 S1D 13 S2D 2 3 4 12 DD 11 S1C 10 S2C 5 6 7 8 9 DC • IN S1A S2A DA S1B S2B DB GND IN • • • D, DBQ, DGV, OR PW PACKAGE (TOP VIEW) Low Differential Gain and Phase (DG = 0.82%, DP = 0.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 DESCRIPTION/ORDERING INFORMATION This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 4.6 V VI/O Switch I/O voltage range (2) (3) (4) 4.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 Electrical Characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER IIN = –18 mA UNIT VIK EN, IN Vhys EN, IN IIH EN, IN VCC = 3.6 V, VIN and VEN = VCC ±1 µA IIL EN, IN VCC = 3.6 V, VIN and VEN = GND ±1 µA IOZ (3) VCC = 3.6 V, VO = 0 to 3.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 TYPICAL CHARACTERISTICS 0 0 Phase −1 −10 −20 −2 −30 Gain −4 −40 −5 −50 −6 −60 −7 −70 −8 −80 −90 1000 −9 1 10 Phase − Deg Gain − dB −3 100 Frequency − MHz Gain 3 dB at 400 MHz Phase at 3-dB Frequency, −38.28 Degrees 0.0 0.08 −0.2 0.07 0.06 Differential Gain − % −0.4 Differental Gain 0.05 −0.6 −0.8 0.04 −1.0 0.03 −1.2 0.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com 0 160 −10 140 −20 120 Phase −30 100 −40 80 −50 60 Off Isolation −60 40 20 −70 −80 Phase − Deg Off Isolation − dB SCDS162C – MAY 2004 – REVISED JULY 2005 1 10 100 Frequency − MHz Off Isolation Differential at 10Gain Mhz,at−50.08 0.714 V, dB−0.81% Phase Differential at 10 MHz,Phase 87.8 Degrees at 0.714 V, 0.06 Degrees 0 1000 Figure 3.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 Ω IN 50 Ω VG1 S1 DUT VS1 VO D S2 CL (see Note A) EN RL VS2 TEST VCC RL CL VS1 VS2 tON 3.3 V ± 0.3 V 3.3 V ± 0.3 V 75 75 20 20 GND VCC VCC GND tOFF 3.3 V ± 0.3 V 3.3 V ± 0.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER VBIAS BIAS Network Analyzer (HP8753ES) Sawtooth Waveform Generator P1 P2 VCC S1A DA RL = 150 Ω IN DUT VIN EN VEN NOTE: For additional information on measurement method, refer to the TI application report, Measuring Differential Gain and Phase, literature number SLOA040. Figure 6.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC DA S1A RL = 150 Ω IN DUT VIN EN VEN Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog I/O ports are left open.
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TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC S1A DA RL = 150 Ω IN DUT VIN S2A EN RL = 150 Ω 50 Ω† VEN † A 50-Ω termination resistor is needed for the Network Analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel.
PAGE 13
TS3V330 QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE www.ti.com SCDS162C – MAY 2004 – REVISED JULY 2005 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC S1A DA RL = 150 Ω IN 50 Ω† VIN EN DUT VEN DB RIN = 10 Ω † S1B RL = 150 Ω A 50-Ω termination resistor is needed for the network analyzer. Figure 9. Test Circuit for Off Isolation (OIRR) Off isolation is measured at the output of the OFF channel.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3V330DGVR Package Package Pins Type Drawing TVSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 TS3V330DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TS3V330PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3V330DGVR TVSOP DGV 16 2000 367.0 367.0 35.0 TS3V330DR SOIC D 16 2500 333.2 345.9 28.6 TS3V330PWR TSSOP PW 16 2000 367.0 367.0 35.0 TS3V330RGYR VQFN RGY 16 3000 367.0 367.0 35.
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MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°– 8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.