Datasheet
TS3A5017
SCDS188D – JANUARY 2005 – REVISED DECEMBER 2008 ..........................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
µ QFN – RSV Tape and reel TS3A5017RSVR ZVL
QFN – RGY Tape and reel TS3A5017RGYR YA017
Tube TS3A5017D
SOIC – D TS3A5017
Tape and reel TS3A5017DR
– 40 ° C to 85 ° C
SSOP (QSOP) – DBQ Tape and reel TS3A5017DBQR YA017
Tube TS3A5017PW
TSSOP – PW YA017
Tape and reel TS3A5017PWR
TVSOP – DGV Tape and reel TS3A5017DGVR YA017
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
SUMMARY OF CHARACTERISTICS
V
+
= 3.3 V, T
A
= 25 ° C
Dual Analog
Configuration Multiplexer/Demultiplexer
(4:1 Mux/Demux)
Number of channels 2
ON-state resistance (r
on
) 11 Ω
ON-state resistance match ( Δ r
on
) 1 Ω
ON-state resistance flatness (r
on(flat)
) 7 Ω
Turn-on/turn-off time (t
ON
/t
OFF
) 5 ns/1.5 ns
Charge injection (Q
C
) 5 pC
Bandwidth (BW) 165 MHz
OFF isolation (O
ISO
) – 48 dB at 10 MHz
Crosstalk (X
TALK
) – 49 dB at 10 MHz
Total harmonic distortion (THD) 0.21%
Leakage current (I
D(OFF)
/I
S(OFF)
) ± 0.1 µ A
Power-supply current (I
+
) 2.5 µ A
16-pin QFN, µ QFN, SOIC,
Package options
SSOP, TSSOP, or TVSOP
2 Submit Documentation Feedback Copyright © 2005 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TS3A5017