Datasheet

ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE THERMAL IMPEDANCE
TS3A4751
SCDS227D – JULY 2006 – REVISED JULY 2008 .............................................................................................................................................................. www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
SON – RGY Reel of 2000 TS3A4751RGYR YC751
– 40 ° C to 85 ° C micro QFN – RUC Reel of 2000 TS3A4751RUCR 3M
TSSOP – PW Reel of 2000 TS3A4751PWR YC751
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
FUNCTION TABLE
NO TO COM,
IN
COM TO NO
L OFF
H ON
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
+
Supply voltage range referenced to GND
(2)
– 0.3 4 V
V
NO
V
COM
Analog and digital voltage range – 0.3 V
+
+ 0.3 V
V
IN
I
NO
On-state switch current V
NO
, V
COM
= 0 to V
+
– 100 100 mA
I
COM
I
+
Continuous current through V
+
or GND ± 100 mA
I
GND
Peak current pulsed at 1 ms, 10% duty cycle COM, V
I/O
± 200 mA
T
A
Operating temperature range – 40 85 ° C
T
J
Junction temperature 150 ° C
T
stg
Storage temperature range – 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating
conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Signals on COM or NO exceeding V
+
or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
UNIT
PW package 88
θ
JA
Package thermal impedance
(1)
RGY package 91.6 ° C/W
RUC package 216.7
(1) The package thermal impedance is measured in accordance with JESD 51-7.
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