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TS3A26746E

www.ti.com

SCDS313C –FEBRUARY 2011–REVISED MAY 2013

2 X 2 Crosspoint Switch for Audio Applications

Check for Samples: TS3A26746E

FEATURES

PINOUT

• Ultra Low R

for GND Switch (80-mΩ typical)

• R

for MIC Switch <10-Ω

• 3.0V to 3.6V V+ Operation

• Control Input is 1.8-V Logic Compatible

• 6-bump, 0.5mm pitch CSP Package (1.45mm ×

0.95mm × 0.5mm)

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

DESCRIPTION

– 2000-V Human-Body Model (A114-B, Class

The TS3A26746E is a 2 × 2 cross-point switch that is

II)

used to interchange the Ground and MIC connections

– 500-V Charged-Device Model (C101)

on a headphone connector. The Ground switch has

an ultra low R

of <0.1Ω to minimize voltage drop

• ESD Performance (SLEEVE, RING2)

across it, preventing undesired increases in

– ±8-kV Contact Discharge (IEC 61000-4-2)

headphone ground reference voltage. The switch

state is controlled via the SEL input. When

APPLICATIONS

SEL=High, GND is connected to RING2 and MIC is

connected to SLEEVE. When SEL=Low, GND is

• Cellular phones

connected to SLEEVE and MIC is connected to

• PDAs

RING2. An internal 100k pull-up resistor on the SEL

• Portable Instrumentation

input sets the default state of the switch.

• Digital Still Cameras

• Portable Navigation Devices

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (13 pages)

PAGE 1
TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 2 X 2 Crosspoint Switch for Audio Applications Check for Samples: TS3A26746E FEATURES 1 • • • • • • • • Ultra Low RON for GND Switch (80-mΩ typical) RON for MIC Switch <10-Ω 3.0V to 3.6V V+ Operation Control Input is 1.8-V Logic Compatible 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.
PAGE 2
TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TYPICAL APPLICATION BLOCK DIAGRAM MIC BIAS ACCESSORY DATA V+ SLEEVE MIC 100 kW RING2 SEL = H RING1 RIGHT TIP LEFT Figure 1.
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TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 PINOUT 2 1 A B C TERMINAL ASSIGNMENTS 1 2 A SEL V+ B MIC SLEEVE C GND RING2 PIN FUNCTIONS BALL # PIN DESCRIPTION NAME TYPE A1 SEL Input Control Input A2 V+ Power Supply Voltage B1 MIC I/O MIC B2 SLEEV E I/O Sleeve Connection on Headphone Jack C1 GND Ground Ground C2 RING2 I/O 2nd Ring Connection on Headphone Jack Table 1.
PAGE 4
TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V+ Supply voltage range (3) –0.3 4.0 V VMIC VSLEEVE VRING2 Analog voltage range (3) –0.3 4.0 V IK Analog port diode current VI Digital input voltage range –0.
PAGE 5
TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS FOR 3.3 V SUPPLY(1) (continued) V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TA V+ MIN TYP MAX UNIT DIGITAL CONTROL INPUTS (SEL) VIH Input logic high Full 3.6 V 1.2 3.6 V VIL Input logic low Full 3.6 V 0 0.4 V IIH Input logic high leakage current VI = V+ 25°C 3.
PAGE 6
TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com OPERATIONAL CHARACTERISTICS 6 5 SLEEVE-MIC Ron - Ω 4 3 RING2-MIC 2 1 0 0 0.5 1.0 Figure 3. RON 1.5 2.0 2.5 Vin - V vs VIN (MIC Switch) 3.0 PARAMETER MEASRUMENT INFORMATION Figure 4.
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TS3A26746E www.ti.com SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 PARAMETER MEASRUMENT INFORMATION (continued) Figure 5.
PAGE 8
TS3A26746E SCDS313C – FEBRUARY 2011 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision B (November 2011) to Revision C • 8 Page Replaced 1 page preview with full document. ......................................................................................................................
PAGE 9
PACKAGE OPTION ADDENDUM www.ti.com 23-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3A26746EYZPR ACTIVE Package Type Package Pins Package Drawing Qty DSBGA YZP 6 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Device Marking (3) SNAGCU Level-1-260C-UNLIM (4/5) -40 to 85 7N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3A26746EYZPR Package Package Pins Type Drawing SPQ DSBGA 3000 YZP 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 1.02 B0 (mm) K0 (mm) P1 (mm) 1.52 0.63 4.0 W Pin1 (mm) Quadrant 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A26746EYZPR DSBGA YZP 6 3000 182.0 182.0 17.
PAGE 12
D: Max = 1.338 mm, Min =1.277 mm E: Max = 0.838 mm, Min =0.
PAGE 13
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.