Datasheet

ABSOLUTE MINIMUM AND MAXIMUM RATINGS
(1) (2)
THERMAL IMPEDANCE
TS12A44513 , , TS12A44514 , , TS12A44515
SCDS247 OCTOBER 2008 .............................................................................................................................................................................................
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
Reel of 2500 TS12A44513DR TS12A44513
SOIC D Reel of 2500 TS12A44514DR TS12A44514
Reel of 2500 TS12A44515DR TS12A44515
40 ° C to 85 ° C
Reel of 2000 TS12A44513PWR YD4513
TSSOP PW Reel of 2000 TS12A44514PWR YD4514
Reel of 2000 TS12A44515PWR YD4515
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
voltages referenced to GND
MIN MAX UNIT
V
+
Supply voltage range 0.3 13 V
V
NC
V
NO
Analog voltage range
(3)
0.3 V
+
+ 0.3 V
V
COM
I
NC
I
NO
Analog Current range -20 20 mA
I
COM
Continuous current into any terminal ± 20 mA
Peak current, NO or COM (pulsed at 1 ms, 10% duty cycle) ± 30 mA
ESD per method 3015.7 2000 V
T
A
Operating temperature range 40 85 ° C
D package 1.15
Mounted on JEDEC 4-layer board (JESD
P
D
Power dissipation W
51-7), No airflow, T
A
= 25 ° C, T
J
= 125 ° C
PW package 0.88
T
stg
Storage temperature range 65 150 ° C
Lead temperature (soldering, 10 s) 300 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operating
conditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) Voltages exceeding V
+
or GND on any signal terminal are clamped by internal diodes. Limit forward-diode current to maximum current
rating.
UNIT
D package 133
Mounted on JEDEC 1-layer board (JESD 51-3),
No airflow
PW package 167
Thermal impedance,
θ
JA
° C/W
junction to free air
D package 86
Mounted on JEDEC 4-layer board (JESD 51-7),
No airflow
PW package 112
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