Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
TRSF3232ECD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232ECDBG4 ACTIVE SSOP DB 16 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232ECDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECDW OBSOLETE SOIC DW 16 TBD Call TI Call TI 0 to 70 TRSF3232EC
TRSF3232ECDWG4 OBSOLETE SOIC DW 16 TBD Call TI Call TI 0 to 70
TRSF3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 TRSF3232EC
TRSF3232ECPW OBSOLETE TSSOP PW 16 TBD Call TI Call TI 0 to 70 RT32EC
TRSF3232ECPWG4 OBSOLETE TSSOP PW 16 TBD Call TI Call TI 0 to 70
TRSF3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232ECPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 RT32EC
TRSF3232EID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 TRSF3232EI
TRSF3232EIDB OBSOLETE SSOP DB 16 TBD Call TI Call TI -40 to 85 RT32EI
TRSF3232EIDBG4 OBSOLETE SSOP DB 16 TBD Call TI Call TI -40 to 85