Datasheet

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7 Bill of Materials
Table 2 lists the bill of materials for the TPS826xxEVM.
Table 2. TPS826xxEVM-646 Bill of Materials
EVM Device Option: Count
-001 -002 -003 -004 -005 RefDes Value Description Size Part Number Mfr
0 0 0 0 0 C1, C2 Open Capacitor, Ceramic 0603 Std Std
Capacitor, Tantalum, 6.3 V, 70 mΩ,
1 1 1 1 1 C3 150 µF 3528(B) T520B157M006ATE070 Kemet
20%
Connector, SMA , Straight, PC
0 0 0 0 0 J7 Open 901-144-8RFX AMP
0.210 in
2
mount
IC, 600-mA, High-Freq µModule
1 0 0 0 0 U1 TPS82671SIP SIP-8 TPS82671SIP TI
Step-Down Converter
IC, 600-mA, High-Freq µModule
0 1 0 0 0 U1 TPS82675SIP SIP-8 TPS82675SIP TI
Step-Down Converter
IC, 500-mA, High-Freq µModule
0 0 1 0 0 U1 TPS82690SIP SIP-8 TPS82690SIP TI
Step-Down Converter
IC, 500-mA, High-Freq µModule
0 0 0 1 0 U1 TPS82695SIP SIP-8 TPS82695SIP TI
Step-Down Converter
IC, 600-mA, High-Freq µModule
0 0 0 0 1 U1 TPS82672SIP SIP-8 TPS82672SIP TI
Step-Down Converter
8 Marking Information
Table 3 provides the marking information for this EVM.
Table 3. Marking Information
Assembly Number Marking Text
HPA646-001 TPS82671EVM-646
HPA646-002 TPS82675EVM-646
HPA646-003 TPS82690EVM-646
HPA646-004 TPS82695EVM-646
HPA646-005 TPS82672EVM-646
Revision History
Changes from C Revision (June, 2011) to D Revision ................................................................................................... Page
• Added column for -005 option to Table 2 ............................................................................................ 11
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
11
SLVU383D–October 2010–Revised November 2011 Revision History
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