Datasheet

C2
B2
A2
C1
B1
D
E
A1
C3
A3
TOP VIEW BOTTOM VIEW
YML
A1
LSB
CC
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012 www.ti.com
THERMAL INFORMATION
The die temperature of the TPS8267x must be lower than the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking of the TPS8267x.
To estimate the junction temperature, approximate the power dissipation within the TPS8267x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you
have an actual TPS8267x device and TPS82671EVM evaluation module. Then calculate the internal temperature
rise of the TPS8267x above the surface of the printed circuit board by multiplying the TPS8267x power
dissipation by the thermal resistance.
The actual thermal resistance of the TPS8267x to the printed circuit board depends on the layout of the circuit
board, but the thermal resistance given in the Thermal Information Table can be used as a guide.
Three basic approaches for enhancing thermal performance are listed below:
• Improve the power dissipation capability of the PCB design.
• Improve the thermal coupling of the component to the PCB.
• Introduce airflow into the system.
PACKAGE SUMMARY
SIP PACKAGE
Code:
• CC — Customer Code (device/voltage specific)
• YML — Y: Year, M: Month, L: Lot trace code
• LSB — L: Lot trace code, S: Site code, B: Board locator
MicroSiP
TM
DC/DC MODULE PACKAGE DIMENSIONS
The TPS8267x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:
• D = 2.30 ±0.05 mm
• E = 2.90 ±0.05 mm
REFERENCES
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
22 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826745 TPS826765