Datasheet
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
www.ti.com
SLVSAI0F –OCTOBER 2010–REVISED NOVEMBER 2012
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiP
TM
layout.
Figure 43. Recommended Land Pattern Image and Dimensions
SOLDER PAD SOLDER MASK
(5)
COPPER STENCIL
(6)
COPPER PAD STENCIL THICKNESS
DEFINITIONS
(1)(2)(3)(4)
OPENING THICKNESS OPENING
Non-solder-mask
0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick
defined (NSMD)
(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
SURFACE MOUNT INFORMATION
The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
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