Datasheet

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250

225

200

175

150

125

100

0.1 1 10 100 1000

I - Load Current - mA

Power Loss - mW

Efficiency - %

V = 3.6 V,

V = 1.8 V

Efficiency

PFM/PWM Operation

Power Loss

PFM/PWM Operation

VIN

MODE

GND

OUT

1.8 V @ 600mA

TPS82671SIP

2.3 V .. 4.8 V

MODE

SELECTION

ENABLE

DC/DC Converter

GND

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TPS82670

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TPS82677

TPS826711

TPS826721

TPS826745

TPS826765

SLVSAI0H –OCTOBER 2010–REVISED OCTOBER 2014

TPS8267x 600-mA, High-Efficiency MicroSiP™ Step-Down Converter (Profile <1.0mm)

1 Features 3 Description

The TPS8267x device is a complete 600mA, DC/DC

• 90% Efficiency at 5.5MHz Operation

step-down power supply intended for low-power

• 17μA Quiescent Current

applications. Included in the package are the

• Wide V

Range From 2.3V to 4.8V

switching regulator, inductor and input/output

capacitors. No additional components are required to

• 5.5MHz Regulated Frequency Operation

finish the design.

• Spread Spectrum, PWM Frequency Dithering

The TPS8267x is based on a high-frequency

• Best in Class Load and Line Transient

synchronous step-down dc-dc converter optimized for

• ±2% Total DC Voltage Accuracy

battery-powered portable applications. The

• Automatic PFM/PWM Mode Switching

MicroSiP™ DC/DC converter operates at a regulated

5.5-MHz switching frequency and enters the power-

• Low Ripple Light-Load PFM Mode

save mode operation at light load currents to maintain

• ≥35dB V

PSRR (1kHz to 10kHz)

high efficiency over the entire load current range.

• Internal Soft Start, 120-µs Start-Up Time

The PFM mode extends the battery life by reducing

• Integrated Active Power-Down Sequencing

the quiescent current to 17μA (typ) during light load

(Optional)

operation. For noise-sensitive applications, the device

• Current Overload and Thermal Shutdown

has PWM spread spectrum capability providing a

Protection

lower noise regulated output, as well as low noise at

the input. These features, combined with high PSRR

• Sub 1-mm Profile Solution

and AC load regulation performance, make this

• Total Solution Size <6.7 mm

device suitable to replace a linear regulator to obtain

better power conversion efficiency.

2 Applications

The TPS8267x is packaged in a compact (2.3mm x

• Cell Phones, Smart-Phones

2.9mm) and low profile (1.0mm) BGA package

• Camera Module, Optical Data Module

suitable for automated assembly by standard surface

mount equipment.

• Wearable Electronics

• Digital TV, WLAN, GPS and Bluetooth™

Device Information

(1)

Applications

PART NUMBER PACKAGE BODY SIZE (NOM)

• POL Applications

TPS8267x µSIP (8) 2.30 x 2.90 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

4 Simplified Schematic

spacer

Efficiency vs Output Current

spacer

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

Summary of content (29 pages)

PAGE 1
Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 TPS8267x 600-mA, High-Efficiency MicroSiP™ Step-Down Converter (Profile <1.0mm) 1 Features 3 Description • • • • • • • • • • • • The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications.
PAGE 2
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic.............................................
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Changes from Revision A (April 2011) to Revision B • Page Added TPS82676 part number to data sheet header ...........................................................................................................
PAGE 4
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 6 Device Comparison Table PART NUMBER (1) (2) 4 (1) OUTPUT VOLTAGE DEVICE SPECIFIC FEATURE PACKAGE MARKING TPS82670 1.86V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge YK TPS82671 1.8V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage RA TPS826711 1.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 7 Pin Configuration and Functions space SIP-8 (TOP VIEW) VOUT A1 A2 MODE B1 B2 GND C1 C2 A3 C3 SIP-8 (BOTTOM VIEW) VIN VIN EN EN GND GND A3 C3 A2 A1 VOUT B2 B1 MODE C2 C1 GND space Pin Functions PIN NAME VOUT I/O NO. DESCRIPTION A1 O Power output pin.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 8.
PAGE 7
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Electrical Characteristics (continued) Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT = 1.8V, EN = 1.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 8.6 Typical Characteristics 6 28 26 IO = 150 mA TA = 85°C 5.5 TA = 25°C fS - Switching Frequency - MHz 24 IQ - Quiescent Current - mA 22 20 18 16 14 12 TA = -40°C 10 8 6 IO = 300 mA 5 IO = 400 mA 4.5 IO = 500 mA 4 3.5 3 4 2 0 2.7 3 3.3 3.6 3.9 4.2 VI - Input Voltage - V 4.5 2.5 2.5 2.7 4.8 2.9 3.1 3.3 3.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 9 Detailed Description 9.1 Overview The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5MHz frequency pulse width modulation (PWM) at moderate to heavy load currents.
PAGE 10
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 9.3 Feature Description 9.3.1 Power-Save Mode If the load current decreases, the converter enters power-save mode automatically. During power-save mode, the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output ripple compared with other PFM architectures.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Feature Description (continued) The spread spectrum architecture varies the switching frequency by approximately ±10% of the nominal switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and output supplies.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 9.4 Device Functional Modes 9.4.1 Enable The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously described. For proper operation, the EN pin must be terminated and must not be left floating. Pulling the EN pin low forces the device into shutdown.
PAGE 13
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 10 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com Typical Application (continued) At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output capacitor impedance.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Typical Application (continued) 10.2.3 Application Curves VO = 1.8 V VO = 1.2 V Figure 11. Efficiency vs. Load Current VO = 1.8 V PFM/PWM Operation Figure 13. Efficiency vs. Input Voltage VO = 1.2 V PFM/PWM Operation (TPS82675) Figure 15. Peak-to-Peak Output Ripple Voltage vs.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com Typical Application (continued) VO = 1.8 V PFM/PWM Operation (TPS82671) Figure 17. DC Output Voltage vs. Load Current VO = 1.2 V PFM/PWM Operation (TPS82677) Figure 19. DC Output Voltage vs. Load Current VO = 1.8 V MODE = Low (TPS82671) Figure 21.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Typical Application (continued) VO = 1.8 V VI = 3.6 V MODE = Low (TPS82671) Figure 23. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 4.5 V MODE = Low (TPS82671) Figure 25. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 2.7 V MODE = Low (TPS82671) Figure 27.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com Typical Application (continued) VO = 1.8 V VI = 3.6 V MODE = Low (TPS82671) Figure 29. AC Load Transient Response VO = 1.2 V VI = 3.6 V MODE = Low Figure 31. Load Transient Response in PFM/PWM Operation VO = 1.2 V VI = 4.5 V MODE = Low Figure 33.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 Typical Application (continued) VO = 1.2 V VI = 2.7 V MODE = Low Figure 35. Load Transient Response in PFM/PWM Operation VO = 1.2 V VI = 3.6 V MODE = Low (TPS82671) VO = 1.2 V Figure 39. PFM/PWM Boundaries Copyright © 2010–2014, Texas Instruments Incorporated (TPS82674) MODE = Low (TPS82671) Figure 36.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com Typical Application (continued) VO = 1.8 V RL = 100 Ω VI = 3.6 V (TPS82671) MODE = Low Figure 41. Start-Up 11 Power Supply Recommendations The TPS8267X devices are designed to operate from a 2.3-V to 4.8-V input voltage supply.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 www.ti.com SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 12 Layout 12.1 Layout Guidelines In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width.
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TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675 TPS82676, TPS82677, TPS826711, TPS826721, TPS826745, TPS826765 SLVSAI0H – OCTOBER 2010 – REVISED OCTOBER 2014 www.ti.com 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 References "EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2014 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 26
PACKAGE MATERIALS INFORMATION www.ti.com 10-Oct-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS826711SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82671SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82672SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 10-Oct-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS826711SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS82671SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS82672SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS82673SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS826745SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS82675SIPR uSiP SIP 8 3000 223.0 194.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.