Datasheet

www.ti.com Bill of Materials
Figure 6. TPS8125xEVM Bottom Copper
5 Bill of Materials
Table 2 lists the EVM components as configured according to the schematic shown in Figure 1.
Table 2. TPS8125xEVM Bill of Materials
Count Ref Des Value Description Size Part Number MFR
1 C1 150 µF Capacitor, Tantalum, 6.3 V, 70 mΩ, 20% 3528 (B) T520B157M006ATE070 Kemet
0 C2 Open Capacitor, Ceramic 0402 Std Std
1 C3 4.7 µF Capacitor, Ceramic, 16 V, X5R, 10% 0603 GRM188R61C475KAAJ Murata
0 C4 Open Capacitor, Ceramic 0603 Std Std
2 J1, J2 PEC06SAAN Header, Male 6-pin, 100mil spacing 0.100 inch x 6 PEC06SAAN Sullins
0 J3, J4 Open Connector, SMT Straight, Jack Receptacle 0.250 SQ 142-0711-201 Johnson
1 JP1 PEC03SAAN Header, Male 3-pin, 100mil spacing 0.100 inch x 3 PEC03SAAN Sullins
0 R1, R2 Open Resistor, Chip, 1/16W, 1% 0402 Std Std
1 R3 1.00MΩ Resistor, Chip, 1/16W, 1% 0603 Std Std
IC, High-Efficiency Micro-SiP Boost
1 U1 TPS81256SIP uBGA TPS81256SIP TI
Converter, 5.0 V
9
SLVU653–April 2012 TPS8125xEVM
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