Datasheet

Board Layouts

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The thermal resistance for the TPS7A7A00EVM-718 is the measured value for this particular layout

scheme. The maximum power dissipation is proportional to the volume of copper volume connected to the

package.

6 Board Layouts

Figure 3. Assembly Layer

Figure 4. Top Layer Routing

TPS7A7x00EVM-718 Evaluation Module SLAU430–February 2012

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