Datasheet

P
D
+
ǒ
V
IN
* V
OUT
Ǔ
I
OUT
R =
qJA
+125 C T° -
A
P
D
TPS7A7001
SBVS134D –JANUARY 2012–REVISED SEPTEMBER 2013 www.ti.com
THERMAL INFORMATION Power dissipation can be minimized and greater
efficiency can be achieved by using the lowest
Thermal Protection possible input voltage necessary to achieve the
required output voltage regulation.
Thermal protection disables the output when the
junction temperature rises to approximately +160°C, On the SOIC (DDA) package, the primary conduction
allowing the device to cool. When the junction path for heat is through the exposed pad to the
temperature cools to approximately +140°C, the printed circuit board (PCB). The pad can be
output circuitry is enabled again. connected to ground or left floating; however, it
should be attached to an appropriate amount of
The internal protection circuitry of the TPS7A7001 is
copper PCB area to ensure the device does not
designed to protect against overload conditions. It is
overheat. The maximum junction-to-ambient thermal
not intended to replace proper heatsinking.
resistance depends on the maximum ambient
Continuously running the TPS7A7001 into thermal
temperature, maximum device junction temperature,
shutdown degrades device reliability.
and power dissipation of the device and can be
calculated using Equation 3:
Power Dissipation
Power dissipation of the device depends on the input
voltage and load conditions and can be calculated
(3)
using Equation 2:
(2)
8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: TPS7A7001