Datasheet

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Board Layout

The thermal interface between the case and the heat sink, θ

, is controlled by selecting the right heat

conducting material. Once the θ

is selected, the required thermal resistance from the heatsink to

ambient is calculated by Equation 6:

(6)

This information allows the user to select the most appropriate heatsink for any particular application.

The heat sink chosen for the TPS7A3301EVM-061 (507302B00000G from Aavid) has a specified thermal

resistance (θ

) of 24°C/W. There is also an option of using the two large mounting holes (13 and 14 –

see Figure 4) to mount a heat sink with a smaller thermal resistance. The mounting holes are sized for the

use of any heat sink with solderable mounting tab spacing of 1 inch (25.4 mm). The 5310 series from

Aavid is one example and has a specified thermal resistance (θ

) of 13.4°C/W.

7 Board Layout

Figure 4. Top Layer Silkscreen

SLVU602–November 2011 TPS7A3301EVM-061

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