Datasheet

TPS7A3001-EP
www.ti.com SBVS174 –OCTOBER 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
ORDERABLE PART TOP-SIDE
T
J
PACKAGE VID NUMBER
NUMBER MARKING
–55°C to 125°C DGN TPS7A3001MDGNTEP PXCM V62/11619-01XE
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted).
VALUE
MIN MAX UNIT
IN pin to GND pin –36 +0.3 V
OUT pin to GND pin –33 +0.3 V
OUT pin to IN pin –0.3 +36 V
FB pin to GND pin –2 +0.3 V
Voltage FB pin to IN pin –0.3 +36 V
EN pin to IN pin –0.3 +36 V
EN pin to GND pin –36 +36 V
NR/SS pin to IN pin –0.3 +36 V
NR/SS pin to GND pin –2 +0.3 V
Current Peak output Internally limited
Operating virtual junction, T
J
–55 +135 °C
Temperature
Storage, T
stg
–65 +150 °C
Human body model (HBM) 1500 V
Electrostatic discharge rating
Charged device model (CDM) 500 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TPS7A3001
THERMAL METRIC
(1)
DGN UNITS
8 PINS
θ
JA
Junction-to-ambient thermal resistance 69.3
θ
JC(top)
Junction-to-case(top) thermal resistance 40.3
θ
JB
Junction-to-board thermal resistance 39.0
°C/W
ψ
JT
Junction-to-top characterization parameter 2.4
ψ
JB
Junction-to-board characterization parameter 38.7
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance 17.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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