Datasheet

TPS797xx
SLVS332I –MARCH 2001–REVISED OCTOBER 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
(2)
TPS797xx yy yz XX is nominal output voltage (for example, 25 = 2.5V).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Output voltages from 1.25V to 4.9V in 50mV increments are available through the use of probe level programming; minimum order
quantities may apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating junction temperature range, unless otherwise noted.
Input voltage range
(2)
–0.3V to 6V
Maximum dc output voltage 4.9V
Peak output current Internally limited
ESD rating, HBM 2kV
ESD rating, CDM 500V
Continuous total power dissipation See Dissipation Ratings Table
Operating virtual junction temperature range, T
J
–40°C to +85°C
Storage temperature range, T
STG
–65°C to +150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
PACKAGE DISSIPATION RATINGS
R
θJC
R
θJA
DERATING FACTOR T
A
≤ +25 ° C T
A
= +70°C T
A
= +85°C
BOARD PACKAGE
°C/W °C/W ABOVE T
A
= +25°C POWER RATING POWER RATING POWER RATING
Low K
(1)
DCK 165.39 396.24 2.52mW/°C 252mW 139mW 101mW
High K
(2)
DCK 165.39 314.74 3.18mW/°C 318mW 175mW 127mW
(1) The JEDEC low K (1s) board design used to derive this data was a 3-inch × 3-inch, two layer board with 2 ounce copper traces on top
of the board.
(2) The JEDEC high K (2s2p) board design used to derive this data was a 3-inch × 3-inch, multilayer board with 1 ounce internal power and
ground planes and 2 ounce copper traces on top and bottom of the board.
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