Datasheet
P =(V V ) I- ´
D IN OUT OUT
TPS783xx
SBVS133 –FEBRUARY 2010
www.ti.com
POWER DISSIPATION
dissipation depends on input voltage and load
conditions. Power dissipation (P
D
) is equal to the
The ability to remove heat from the die is different for
product of the output current times the voltage drop
each package type, presenting different
across the output pass element (V
IN
to V
OUT
), as
considerations in the PCB layout. The PCB area
shown in Equation 2:
around the device that is free of other components
moves the heat from the device to the ambient air.
(2)
Performance data for JEDEC low- and high-K boards
are given in the Dissipation Ratings table. Using
PACKAGE MOUNTING
heavier copper increases the effectiveness in
Solder pad footprint recommendations for the
removing heat from the device. The addition of plated
TPS783 series are available from the Texas
through-holes to heat-dissipating layers also
Instruments web site at www.ti.com through the
improves the heatsink effectiveness. Power
TPS783 series product folders.
12 Copyright © 2010, Texas Instruments Incorporated