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TPS783xxDDC

TSOT23-5

(TOPVIEW)

OUT

GND

TPS783xx

www.ti.com

SBVS133 –FEBRUARY 2010

500nA I

, 150mA, Ultra-Low Quiescent Current

Low-Dropout Linear Regulator

FEATURES

DESCRIPTION

• Low I

: 500nA

The TPS783 family of low-dropout regulators (LDOs)

offers the benefits of ultra-low power (I

= 500nA),

• 150mA, Low-Dropout Regulator

and miniaturized packaging.

• Low-Dropout at +25°C, 130mV at 150mA

This LDO is designed specifically for battery-powered

• Low-Dropout at +85°C, 175mV at 150mA

applications where ultra-low quiescent current is a

• 3% Accuracy Over Load/Line/Temperature

critical parameter. The TPS783, with ultra-low I

• Available in Fixed Voltage Options Using

(500nA), is ideal for microprocessors,

Innovative Factory EEPROM Programming

microcontrollers, and other battery-powered

applications.

• Stable with a 1.0mF Ceramic Capacitor

• Thermal Shutdown and Overcurrent Protection

The absence of pulldown circuitry at the output of the

TPS783 LDO gives an application the flexibility to use

• CMOS Logic Level-Compatible Enable Pin

the regulator output capacitor as a temporary backup

• DDC (TSOT23-5) Package

power supply for a short period of time without the

presence of the battery when the LDO is disabled

APPLICATIONS

(during battery replacement).

• TI MSP430 Attach Applications

The ultra-low power and miniaturized packaging allow

• Power Rails with Programming Mode

designers to customize power consumption for

• Wireless Handsets, Smartphones, PDAs, MP3

specific applications. Consult with your local factory

Players, and Other Battery-Operated Handheld

representative for exact voltage options and ordering

Products

information; minimum order quantities may apply.

The TPS783 family is designed to be compatible with

the TI MSP430 and other similar products. The

enable pin (EN) is compatible with standard CMOS

logic. This LDO is stable with any output capacitor

greater than 1.0mF. Therefore, this device requires

minimal board space because of miniaturized

packaging and a potentially small output capacitor.

The TPS783 series also features thermal shutdown

and current limit to protect the device during fault

conditions. All packages have an operating

temperature range of T

= –40°C to +105°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

PAGE 1
TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 500nA IQ, 150mA, Ultra-Low Quiescent Current Low-Dropout Linear Regulator FEATURES DESCRIPTION • • • • • • The TPS783 family of low-dropout regulators (LDOs) offers the benefits of ultra-low power (IQ = 500nA), and miniaturized packaging.
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TPS783xx SBVS133 – FEBRUARY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 ELECTRICAL CHARACTERISTICS Over operating temperature range (TJ = –40°C to +105°C), VIN = VOUT(NOM) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1.0mF, fixed VOUT test conditions, unless otherwise noted. Typical values at TJ = +25°C. TPS783xx PARAMETER VIN TEST CONDITIONS Input voltage range ΔVOUT/ΔVIN DC output accuracy Line regulation (1) % –3.0 ±2.0 +3.0 % VOUT(NOM) + 0.5V ≤ VIN ≤ 5.5V ±1.0 % 100mA ≤ IOUT ≤ 150mA ±1.
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TPS783xx SBVS133 – FEBRUARY 2010 www.ti.com FUNCTIONAL BLOCK DIAGRAM IN OUT Current Limit Mux Thermal Shutdown EEPROM EN Bandgap Logic GND PIN CONFIGURATIONS DDC PACKAGE TSOT23-5 (TOP VIEW) IN GND (1) EN (1) 1 5 OUT 4 GND 2 3 (1) All ground pins must be connected to ground for proper operation. Table 1. PIN DESCRIPTIONS PIN NAME 4 DDC DESCRIPTION OUT 5 Regulated output voltage pin. A small (1mF) ceramic capacitor is needed from this pin to ground to assure stability.
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TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 TYPICAL CHARACTERISTICS Over the operating temperature range of TJ = –40°C to +105°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. TPS78330 LINE REGULATION IOUT = 5mA, VOUT(NOM) = 3.0V TPS78330 LINE REGULATION IOUT = 150mA, VOUT(NOM) = 3.0V 3 1.0 0.8 -40°C 0.6 2 1 +85°C +25°C 0.2 VOUT (%) VOUT (%) 0.4 0 +105°C -0.2 0 +105°C -1 -0.4 -0.
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TPS783xx SBVS133 – FEBRUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +105°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. TPS78330 GROUND PIN CURRENT vs INPUT VOLTAGE IOUT = 0mA, VOUT(NOM) = 3.0V TPS78330 CURRENT LIMIT vs INPUT VOLTAGE VOUT = 95% VOUT(NOM), VOUT(NOM) = 3.
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TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +105°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. TPS78330 %ΔVOUT vs JUNCTION TEMPERATURE VIN = 3.5V, VOUT(NOM) = 3.0V TPS78330 OUTPUT SPECTRAL NOISE DENSITY CIN = 1mF, COUT = 2.2mF, VIN = 3.5V, VOUT(NOM) = 3.0V 3 Output Spectral Noise Density (mV/ÖHz) 100 2 10 150mA 0.
PAGE 8
TPS783xx SBVS133 – FEBRUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +105°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. Voltage (100mV/div) TPS78330 LOAD TRANSIENT RESPONSE VIN Enable VOUT Load Current Current (10mA/div) VIN = 5.5V VOUT = 3.0V IOUT = 0mA to 10mA COUT = 10mF 0A Time (5ms/div) Figure 17.
PAGE 9
TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 APPLICATION INFORMATION APPLICATION EXAMPLES The TPS783 family of LDOs is factory-programmable to have a fixed output. Note that during startup or steady-state conditions, it is important that the EN pin voltage never exceed VIN + 0.3V. 4.2V to 5.5V VIN 2.
PAGE 10
TPS783xx SBVS133 – FEBRUARY 2010 www.ti.com SUPERCAPACITOR-BASED BACKUP POWER The very low leakage current at the LDO output gives a system the flexibility to use the device output capacitor as a temporary backup power supply for a short period of time, without the presence of the battery when the LDO is disabled (during battery replacement). The leakage current going into the regulator output from the output capacitor, when the LDO is disabled, is typically 170nA, see Figure 10.
PAGE 11
TPS783xx www.ti.com SBVS133 – FEBRUARY 2010 INTERNAL CURRENT LIMIT TRANSIENT RESPONSE The TPS783 is internally current-limited to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of output voltage. For reliable operation, the device should not be operated in a current limit state for extended periods of time.
PAGE 12
TPS783xx SBVS133 – FEBRUARY 2010 POWER DISSIPATION The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Dissipation Ratings table. Using heavier copper increases the effectiveness in removing heat from the device.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 11-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TPS78318DDCR SOT DDC 5 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS78318DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS78319DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS78319DDCT SOT DDC 5 250 179.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS78318DDCR SOT DDC 5 3000 195.0 200.0 45.0 TPS78318DDCT SOT DDC 5 250 195.0 200.0 45.0 TPS78319DDCR SOT DDC 5 3000 195.0 200.0 45.0 TPS78319DDCT SOT DDC 5 250 195.0 200.0 45.0 TPS78326DDCR SOT DDC 5 3000 195.0 200.0 45.0 TPS78326DDCT SOT DDC 5 250 195.0 200.0 45.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.