Datasheet

IN
GND
(1)
EN
6
5
4
OUT
N/C
GND
(1)
1
2
3
Thermal
Pad
(2)
OUT
GND
(1)
IN
GND
(1)
EN
1
2
3
5
4
Thermal
Shutdown
10kW
Current
Limit
Bandgap
IN
EN
OUT
EEPROM
Mux
Logic
Active
Pull-
Down
GND
TPS782xx
SBVS115C –AUGUST 2008–REVISED JANUARY 2014 www.ti.com
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATIONS
DDC PACKAGE
DRV PACKAGE
TSOT23-5
2mm x 2mm SON-6
(TOP VIEW)
(TOP VIEW)
(1) All ground pins must be connected to ground for proper operation.
(2) It is recommended that the thermal pad be grounded.
Table 1. PIN DESCRIPTIONS
PIN
NAME DRV DDC DESCRIPTION
Regulated output voltage pin. A small (1μF) ceramic capacitor is needed from this pin to
OUT 1 5 ground to assure stability. See the Input and Output Capacitor Requirements in the
Application Information section for more details.
N/C 2 — Not connected.
Driving the enable pin (EN) over 1.2V turns ON the regulator. Driving this pin below 0.4V
EN 4 3
puts the regulator into shutdown mode, reducing operating current to 18nA typical.
GND 3, 5 2, 4 ALL ground pins must be tied to ground for proper operation.
Input pin. A small capacitor is needed from this pin to ground to assure stability. Typical input
IN 6 1 capacitor = 1.0μF. Both input and output capacitor grounds should be tied back to the IC
ground with no significant impedance between them.
Thermal pad Thermal pad — It is recommended that the thermal pad on the SON-6 package be connected to ground.
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