Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS77633DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS77633PWPR HTSSOP PWP 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS77501DR SOIC D 8 2500 367.0 367.0 35.0
TPS77501PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77515DR SOIC D 8 2500 367.0 367.0 35.0
TPS77515PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77516DR SOIC D 8 2500 367.0 367.0 35.0
TPS77516PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77518DR SOIC D 8 2500 367.0 367.0 35.0
TPS77518PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77525DR SOIC D 8 2500 367.0 367.0 35.0
TPS77533DR SOIC D 8 2500 367.0 367.0 35.0
TPS77533PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77601DR SOIC D 8 2500 367.0 367.0 35.0
TPS77601PWPR HTSSOP PWP 20 2000 367.0 367.0 38.0
TPS77615DR SOIC D 8 2500 367.0 367.0 35.0
TPS77618DR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 26-Jan-2013
Pack Materials-Page 2