Datasheet

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15
20
25
30
35
40
0 0.01 0.1 1 10 100
Copper Heatsink Area − cm
2
− Thermal Resistance −
θJA
R C/W
°
No Air Flow
150 LFM
250 LFM
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper
Solder Pad
with 25 Thermal
Vias
Thermal Vias, 0.3 mm
Diameter, 1.5 mm Pitch
TPS75901, TPS75915
TPS75918, TPS75925, TPS75933
SLVS318E – DECEMBER 2000 – REVISED MARCH 2004
THERMAL INFORMATION (continued)
Figure 25. Thermal Resistance vs Copper Heatsink Area
Figure 26.
From the data in Figure 25 and rearranging Equation 4 , the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed (see Figure 27 ).
18