Datasheet

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS TABLE
TPS75801 , , TPS758A01
TPS75815 , TPS75818
TPS75825 , TPS75833
SLVS330F – JUNE 2001 – REVISED APRIL 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
TPS758 xxyyyz XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable).
or YYY is package designator.
TPS758A01 yyyz
(2)
Z is package quantity.
(1) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet
or see the TI website at www.ti.com .
(2) TPS758A01 available in adjustable version only. See TPS758A01 Reference Voltage in Electrical Characteristics for different V
REF
range.
Over operating junction temperature range (unless otherwise noted)
(1) (2)
TPS758xx UNIT
Input voltage range, V
IN
–0.3 to 6 V
Voltage range at EN –0.3 to 6 V
Peak output current Internally limited
Continuous total power dissipation See Dissipation Ratings Table
Output voltage, V
OUT
(OUT, FB) 5.5 V
Operating junction temperature range, T
J
–40 to +150 ° C
Storage temperature range, T
STG
–65 to +150 ° C
ESD rating, HBM 2 kV
ESD rating, CDM 500 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network terminal ground.
PACKAGE R
Θ JC
( ° C/W) R
Θ JA
( ° C/W)
(1)
TO-220 2 58.7
(2)
TO-263 2 38.7
(3)
(1) For both packages, the R
Θ JA
values were computed using a JEDEC High-K board (2S2P) with a 1-ounce internal copper plane and
ground plane. There was no air flow across the packages.
(2) R
Θ JA
was computed assuming a vertical, free-standing TO-220 package with pins soldered to the board. There is no heatsink attached
to the package.
(3) R
Θ JA
was computed assuming a horizontally-mounted TO-263 package with pins soldered to the board. There is no copper pad
underneath the package.
2
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