Datasheet

www.ti.com
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
With 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1.5 mm Pitch
1
2
3
4
5
0 0.01 0.1 1 10 100
− Maximum Power Dissipation − W
P
D
Copper Heatsink Area − cm
2
T
A
= 55°C
No Air Flow
150 LFM
250 LFM
TPS75801 , , TPS758A01
TPS75815 , TPS75818
TPS75825 , TPS75833
SLVS330F – JUNE 2001 – REVISED APRIL 2007
THERMAL INFORMATION (continued)
Figure 27. TO-263 Thermal Resistance
The maximum power dissipation for a different ground plane area and a specific ambient temperature can be
computed from the data in Figure 26 and from rearranging Equation 6 (see Figure 28 ).
Figure 28. Maximum Power Dissipation vs Copper Heatsink Area
17
Submit Documentation Feedback