Datasheet
www.ti.com
5
15
25
35
45
55
65
0510152025
R
θ
SA
– Heatsink Thermal Resistance – °C/W
THERMAL RESISTANCE
vs
HEATSINK THERMAL RESISTANCE
– Thermal Resistance –
θJA
R C/W
°
No Heatsink
Natural Convection
Air Flow = 150 LFM
Air Flow = 250 LFM
Air Flow = 500 LFM
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
0.21 mm
0.21 mm
TPS75601, TPS75615
TPS75618, TPS75625
TPS75633
SLVS329C – JUNE 2001 – REVISED MARCH 2004
THERMAL INFORMATION (continued)
Figure 22.
Figure 23.
From the data in Figure 22 and rearranging Equation 4 , the maximum power dissipation for a different heatsink
R
ΘSA
and a specific ambient temperature can be computed (see Figure 24 ).
14