Datasheet

       
    
 
SLVS293D − NOVEMBER 2000 − REVISED MAY 2002
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL INFORMATION
TO−263 power dissipation (continued)
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
with 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1.5 mm Pitch
Figure 26
From the data in Figure 25 and rearranging equation 4, the maximum power dissipation for a different ground
plane area and a specific ambient temperature can be computed (see Figure 27).
Figure 27
1
2
3
4
5
0 0.01 0.1 1 10 100
MAXIMUM POWER DISSIPATION
vs
COPPER HEATSINK AREA
− Maximum Power Dissipation − W
P
D
Copper Heatsink Area − cm
2
T
A
= 55°C
No Air Flow
150 LFM
250 LFM