Datasheet

       
    
 
SLVS293D − NOVEMBER 2000 − REVISED MAY 2002
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
THERMAL INFORMATION
TO−220 power dissipation (continued)
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
0.21 mm
0.21 mm
Figure 23
From the data in Figure 22 and rearranging equation 4, the maximum power dissipation for a different heatsink
R
θSA
and a specific ambient temperature can be computed (see Figure 24).
Figure 24
1
10
01020
− Power Dissipation Limit − W
P
D
POWER DISSIPATION
vs
HEATSINK THERMAL RESISTANCE
R
θSA
− Heatsink Thermal Resistance − °C/W
No Heatsink
T
A
= 55°C
Natural Convection
Air Flow = 150 LFM
Air Flow = 250 LFM
Air Flow = 500 LFM