Datasheet

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DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
TPS751xxQ
TPS753xxQ
SLVS241C – MARCH 2000 – REVISED OCTOBER 2007
AIRFLOW DERATING FACTOR
BOARD PACKAGE (CFM) T
A
< +25 ° C ABOVE T
A
= +25 ° C T
A
= +70 ° C T
A
= +85 ° C
0 2.9 mW 23.5 mW/ ° C 1.9 W 1.5 W
Low-K
(1)
PWP
300 4.3 mW 34.6 mW/ ° C 2.8 W 2.2 W
0 3 W 23.8 mW/ ° C 1.9 W 1.5 W
High-K
(2)
PWP
300 7.2 W 57.9 mW/ ° C 4.6 W 3.8 W
(1) This parameter is measured with the recommended copper heat sink pattern on a 1-layer, 5-in נ 5-in printed circuit board (PCB), 1-ounce
copper, 2-in נ 2-in coverage (4 in
2
).
(2) This parameter is measured with the recommended copper heat sink pattern on a 8-layer, 1.5-in נ 2-in PCB, 1-ounce copper with layers
1, 2, 4, 5, 7, and 8 at 5% coverage (0.9 in
2
) and layers 3 and 6 at 100% coverage (6 in
2
). For more information, refer to TI technical brief
SLMA002 .
MIN MAX MAX
V
IN
Input voltage range
(1)
2.7 5.5 V
V
OUT
Output voltage range 1.5 5 V
I
OUT
Output current 0 2.0 A
T
J
Operating virtual junction temperature – 40 +125 ° C
(1) To calculate the minimum input voltage for your maximum output current, use the following equation: V
IN(min)
= V
OUT(max)
+ V
DO(max load)
.
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