Datasheet

TPS75003-EP
www.ti.com SGLS311A –DECEMBER 2006– REVISED MARCH 2011
Figure 1. Wirebond Plot
THERMAL INFORMATION
TPS75003-EP
THERMAL METRIC
(1)
UNITS
RHL (20 PINS)
θ
JA
Junction-to-ambient thermal resistance 42.6
θ
JCtop
Junction-to-case (top) thermal resistance 51.8
θ
JB
Junction-to-board thermal resistance 39.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.6
ψ
JB
Junction-to-board characterization parameter 14.2
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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