Datasheet

4 Bill of Materials and Schematic
4.1 Bill of Materials
Bill of Materials and Schematic www.ti.com
Table 2. HPA210 Bill of Materials
Count Reference Value Description Size Part Number MFR
Designator
1 C1 1.0 µ F Capacitor, Ceramic, 25V, X5R, 10% 0603 C1608X5R1E105K TDK
1 C2 2.2 µ F Capacitor, Ceramic, 6.3V, X5R, 0603 C1608X5R0J225M TDK
20%
1 C3 1.0 µ F Capacitor, Ceramic, 10V, X5R,10% 0603 C1608X5R1A105K TDK
0 C4, C5 Open Capacitor, Multi-pattern, 603-D case 7343 (D)
1 C6 560 pF Capacitor, Ceramic, 50V, C0G, 5% 0603 C1608C0G1H561J TDK
2 J1, J8 Terminal Block, 2 pin, 6A, 3.5mm 0.27 x 0.25 ED1514 OST
6 J2 - J7 Header, 2 pin, 100mil spacing, 0.100 x 2 PTC36SAAN Sullins
(36-pin strip)
1 JP1 Header, 2 pin, 100mil spacing, 0.100 x 2 PTC36SAAN Sullins
(36-pin strip)
1 R1 2.49 k Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
1 R2 2.49 k Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
2 R3, R4 100 k Ω Resistor, Chip, 1/16W, 1% 0603 Std Std
4 TP1 - TP4 Test Point, Red, Thru Hole Color 0.100 x 0.100 5000 Keystone
Keyed
0 TP5 Test Point, Red, Thru Hole Color 0.100 x 0.100
Keyed
1 U1 IC, 3A LDO With Low Dropout QFN-20 TPS74901RGW TI
1 – PCB, 2.1 In x 1.145 In x 0.062 In HPA210 Any
1 – Shunt, 100mil, Black 0.100 929950-00 3M
6 TPS74901EVM-210 SLVU190B – April 2007 – Revised July 2008
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