Datasheet

TPS744xx
SBVS066O –DECEMBER 2005–REVISED MARCH 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
(2)
TPS744xx yyy z XX is nominal output voltage (for example, 12 = 1.2V, 15 = 1.5V, 01 = Adjustable).
(3)
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Output voltages from 0.9V to 1.5V in 50mV increments and 1.5V to 3.6V in 100mV increments are available through the use of
innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability.
(3) For fixed 0.8V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
(1)
At T
J
= –40°C to +125°C, unless otherwise noted. All voltages are with respect to GND.
TPS744xx UNIT
V
IN
, V
BIAS
Input voltage range –0.3 to +6 V
V
EN
Enable voltage range –0.3 to +6 V
V
PG
Power-good voltage range –0.3 to +6 V
I
PG
PG sink current 0 to +1.5 mA
V
SS
SS pin voltage range –0.3 to +6 V
V
FB
Feedback pin voltage range –0.3 to +6 V
V
OUT
Output voltage range –0.3 to V
IN
+ 0.3 V
I
OUT
Maximum output current Internally limited
Output short circuit duration Indefinite
P
DISS
Continuous total power dissipation See Thermal Information Table
T
J
Operating junction temperature range –40 to +150 °C
T
STG
Storage junction temperature range –55 to +150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
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