Datasheet

55
50
45
40
35
30
25
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
q
JA
(°C/W)
Area(in )
2
4.5
0LFM
150LFM
250LFM
T
J
R
qJC
R
qCS
R
qSA
T
C
T
S
T
A
4-layer.0.062” FR4
Viasare0.012” diameter,plated
Top/Bottomlayersare2oz.copper
Innerlayersare1oz.copper
0.062in.
R
qJA
= R +R +R
q q qJC CS SA
PCBCrossSection
PCBTopView
0.5in
2
1.0in
2
2.0in
2
TPS74401-EP
SBVS122B –MARCH 2010–REVISED SEPTEMBER 2010 www.ti.com
Figure 32. PCB Layout and Corresponding R
qJA
Data, Buried Thermal Plane, No Vias Under Thermal Pad
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