Datasheet

  
   
SLVS167C − SEPTEMBER 1998 − REVISED − MAY 1999
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 31
192
191
196
190
− Reset Delay Time − ms
194
193
195
RESET DELAY TIME
vs
FREE-AIR TEMPERATURE
197
t
d
T
A
− Free-Air Temperature −°C
−50 −25 0 25 50 75 100 125
Figure 32
25
20
10
5
0
45
15
180 185 190 195
Percentage of Units − %
35
30
40
DISTRIBUTION FOR RESET DELAY
50
200 205 210
t
d
− Reset Delay Time − ms
T
A
= 25°C
197 Devices
THERMAL INFORMATION
The TPS73HD3xx is packaged in a high-power dissipation downset lead frame for optimal power handling. with
proper heat dissipation techniques, the full power soutput of these devices can be safely handled over the full
temperture range. The Texas Instruments technical brief, PowerPAD Thermally Enhanced Package (literature
number SLMA002), goes into considerable detail into techniques for properly mounting this type of package for
maximum thermal performance. A thermal conduction plane of approximately 3I y 3I will give a power dissipatio level
of 4.5 W.
Power dissipation within the device can be calculated with the following equation:
P
D
+ P
IN
–P
OUT
+ V
I
ǒ
I
O1
) I
O2
Ǔ
–
ǒ
V
O1
I
O1
) V
O2
I
O2
Ǔ