Datasheet
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
TPS73719-Q1
TPS73733-Q1
SBVS123 – DECEMBER 2008 ...........................................................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
over operating free-air temperature range unless otherwise noted
(1)
V
IN
range – 0.3 V to 6.0 V
V
EN
range – 0.3 V to 6.0 V
V
OUT
range – 0.3 V to 5.5 V
V
NR
, V
FB
range – 0.3 V to 6.0 V
Peak output current Internally limited
Output short-circuit duration Indefinite
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, T
J
– 55 ° C to 150 ° C
Storage temperature range – 65 ° C to 150 ° C
ESD rating, HBM 2000 V
ESD rating, CDM 500 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
DERATING FACTOR T
A
≤ 25 ° C T
A
= 70 ° C T
A
= 85 ° C
BOARD PACKAGE R
θ JC
R
θ JA
ABOVE T
A
= 25 ° C POWER RATING POWER RATING POWER RATING
High-K
(2) (3)
DRB 1.2 ° C/W 40 ° C/W 25.0 mW/ ° C 2.50 W 1.38 W 1.0 W
(1) See Power Dissipation in the Applications section for more information related to thermal design.
(2) The JEDEC High-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on the top and bottom of the board.
(3) Based on preliminary thermal simulations.
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