Datasheet

TPS7301Q, TPS7325Q, TPS7330Q, TPS7333Q, TPS7348Q, TPS7350Q
LOW-DROPOUT VOLTAGE REGULATORS
WITH INTEGRATED DELAYED RESET FUNCTION
SLVS124F – JUNE 1995 – REVISED JANUARY 1999
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TPS73xxY chip information
These chips, when properly assembled, display characteristics similar to those of the TPS73xxQ. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted
with conductive epoxy or a gold-silicon preform.
(6)
(4)
(3)
(7)
(2)
(1)
GND
FB
‡
OUT
RESET
IN
EN
TPS73xx
80
92
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
†
SENSE – Fixed voltage options only (TPS7325, TPS7330,
TPS7333, TPS7348, and TPS7350)
‡
FB – Adjustable version only (TPS7301)
BONDING PAD ASSIGNMENTS
SENSE
†
(5)
NOTE A. For most applications, OUT and SENSE should
be tied together as close as possible to the device;
for other implementations, refer to SENSE-pin
connection discussion in the applications
information section of this data sheet.
(3)
(4)
(5)
(6)
(7)
(2)
(1)
functional block diagram
¶
_
+
V
ref
OUT
SENSE
§
/FB
EN
IN
GND
R1
R2
RESET
_
+
TPS7301
TPS7325
TPS7330
TPS7333
TPS7348
TPS7350
DEVICE
UNITR1 R2
0
260
358
420
726
756
∞
233
233
233
233
233
Ω
kΩ
kΩ
kΩ
kΩ
kΩ
RESISTOR DIVIDER OPTIONS
§
For most applications, SENSE should be externally connected to OUT as close as possible to the device. For other implementations, refer to
SENSE-pin connection discussion in applications information section.
¶
Switch positions are shown with EN
low (active).
NOTE A. Resistors are nominal values only.
Delayed
Reset
¶¶
MOS transistors
Bilpolar transistors
Diodes
Capacitors
Resistors
COMPONENT COUNT
464
41
4
17
76